Inventor · disambiguated record
An-Chi Liu
Also filed as: LIU AN · LIU AN-CHI
45 granted patents·8 pending applications·193 citations·filing 2002–2025
97Inventor score
Files withUNITED MICROELECTRONICS CORP31LIU AN-CHI10FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD5E INK HOLDINGS INC3BEIJING SIFANG AUTOMATION CO1
Top patents by PatentIndex Score
53 records- 0198US9899522B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 20, 2018·29 cites·8 claims
- 0296US10109531B1Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·31 cites·20 claims
- 0395US8664060B2Semiconductor structure and method of fabricating the sameLIU AN-CHI·Filed 2012·Granted Mar 4, 2014·22 cites·20 claims
- 0494US9530868B2Fin structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 27, 2016·20 cites·19 claims
- 0593US10991875B2Magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 27, 2021·3 cites·17 claims
- 0693US10283415B2Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 7, 2019·8 cites·20 claims
- 0789US11322600B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 3, 2022·3 cites·20 claims
- 0889US10147795B1Tunneling field effect transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 4, 2018·5 cites·10 claims
- 0988US9054187B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 9, 2015·8 cites·12 claims
- 1086US12262645B2Magnetoresistive random access memory with metal oxide layer on top surface and sidewall of MTJUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
- 1185US12080778B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 3, 2024·0 cites·10 claims
- 1285US11903181B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·14 claims
- 1384US2024371968A1High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1483US9142649B2Semiconductor structure with metal gate and method of fabricating the sameLIU AN-CHI·Filed 2012·Granted Sep 22, 2015·7 cites·6 claims
- 1582US10062584B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·3 cites·19 claims
- 1681US6427896B1Safety device for pneumatic nailersFiled 2002·Granted Aug 6, 2002·37 cites·3 claims
- 1780US12396152B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1879US11784238B2High electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 10, 2023·0 cites·10 claims
- 1979US2025194435A1Magnetoresistive random access memory with protrusions on sides of metal interconnectionUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2075US11758824B2Magnetoresistive random access memory with protrusions on sides of metal interconnectionUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 12, 2023·0 cites·17 claims
- 2175US10276443B2Insulating layer next to fin structure and method of removing fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 30, 2019·2 cites·7 claims
- 2268US8114773B2Cleaning solution, cleaning method and damascene process using the sameLIU AN-CHI·Filed 2010·Granted Feb 14, 2012·2 cites·19 claims
- 2368US8062972B2Semiconductor processLIU AN-CHI·Filed 2009·Granted Nov 22, 2011·3 cites·21 claims
- 2466US9384985B2Semiconductor structure including silicon and oxygen-containing metal layer and process thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·1 cites·5 claims
- 2563US8402634B2Method of continuously mounting clips to two abutted and crossed rodsLIU AN-CHI·Filed 2010·Granted Mar 26, 2013·4 cites·10 claims
- 2663US8252679B2Semiconductor processLIU AN-CHI·Filed 2010·Granted Aug 28, 2012·1 cites·16 claims
- 2762US8877640B2Cleaning solution and damascene process using the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 4, 2014·1 cites·21 claims
- 2862US7691754B2Method for removing photoresist layer and method of forming openingUNITED MICROELECTRONICS CORP·Filed 2006·Granted Apr 6, 2010·2 cites·12 claims
- 2960US2025358540A1Gate driving circuitE INK HOLDINGS INC·Filed 2025·Application pending·0 cites
- 3058US10475892B2Tunneling field effect transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·8 claims
- 3157US11758710B2Memory device and fabrication method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 3257US10886395B2Method for fabricating tunneling field effect transistor having interfacial layer containing nitrogenUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 5, 2021·0 cites·2 claims
- 3357US10069009B2Method for forming recess within epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 4, 2018·0 cites·10 claims
- 3456US12159598B2E-paper display apparatus and driving method of e-paper display panelE INK HOLDINGS INC·Filed 2023·Granted Dec 3, 2024·0 cites·7 claims
- 3555US11551971B2Contact plug structure and manufacturing method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·18 claims
- 3653US12068316B2Semiconductor device and method of forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 3752US12431103B2Gate driver circuitE INK HOLDINGS INC·Filed 2024·Granted Sep 30, 2025·0 cites·11 claims
- 3851US10468517B2Tunneling field effect transistor having interfacial layer containing nitrogenUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 5, 2019·0 cites·6 claims
- 3948US8431488B2Damascene process using cleaning solutionLIU AN-CHI·Filed 2011·Granted Apr 30, 2013·0 cites·11 claims
- 4048US7884026B2Method of fabricating dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 8, 2011·0 cites·13 claims
- 4145US10140410B1Representing a routing strip in an integrated circuit design using a digit patternCADENCE DESIGN SYSTEMS INC·Filed 2016·Granted Nov 27, 2018·0 cites·16 claims
- 4245US9105720B2Semiconductor device having metal gate and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 11, 2015·0 cites·13 claims
- 4345US7670438B2Method of removing particles from waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Mar 2, 2010·0 cites·20 claims
- 4445US2011039415A1Method of fabricating dual damascene structureLIU AN-CHI·Filed 2010·Application pending·0 cites
- 4543US10211107B1Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean stepUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·0 cites·6 claims
- 4642US9679726B2Anti-interference switch signal transmission circuitBEIJING SIFANG AUTOMATION CO·Filed 2013·Granted Jun 13, 2017·0 cites·3 claims
- 4741US2014113425A1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4840US9530646B2Method of forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·18 claims
- 4939US8350334B2Stress film forming method and stress film structureUNITED MICROELECTRONICS CORP·Filed 2011·Granted Jan 8, 2013·0 cites·20 claims
- 5039US2013017659A1Fabricating method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2011·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →