Inventor · disambiguated record
Anthony C. Tsui
Also filed as: TSUI ANTHONY · TSUI ANTHONY C · YANG HONGBO
10 granted patents·8 pending applications·354 citations·filing 1995–2012
90Inventor score
Top patents by PatentIndex Score
18 records- 0193US8358017B2Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2008·Granted Jan 22, 2013·29 cites·22 claims
- 0293US6249041B1IC chip package with directly connected leadsSILICONIX INC·Filed 1998·Granted Jun 19, 2001·196 cites·13 claims
- 0387US7838339B2Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2008·Granted Nov 23, 2010·14 cites·19 claims
- 0481US6277695B1Method of forming vertical planar DMOSFET with self-aligned contactSILICONIX INC·Filed 1999·Granted Aug 21, 2001·52 cites·15 claims
- 0576US6066890ASeparate circuit devices in an intra-package configuration and assembly techniquesSILICONIX INC·Filed 1995·Granted May 23, 2000·53 cites·31 claims
- 0673US7691670B2Interconnection of lead frame to die utilizing flip chip processGEM SERVICES INC·Filed 2008·Granted Apr 6, 2010·5 cites·19 claims
- 0768US8106493B2Semiconductor device package having features formed by stampingTSUI ANTHONY C·Filed 2010·Granted Jan 31, 2012·3 cites·20 claims
- 0856US8097945B2Bi-directional, reverse blocking battery switchHARNDEN JAMES·Filed 2007·Granted Jan 17, 2012·2 cites·17 claims
- 0948US2013105974A1Semiconductor package featuring flip-chip die sandwiched between metal layersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 1046US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 1141US8120154B2Interconnection of lead frame to die utilizing flip chip processESLAMY MOHAMMAD·Filed 2010·Granted Feb 21, 2012·0 cites·10 claims
- 1240US8558368B2Bi-directional, reverse blocking battery switchCHIA ANTHONY·Filed 2011·Granted Oct 15, 2013·0 cites·18 claims
- 1339US2013017652A1Method of manufacturing a semiconductor device package with a heatsinkGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 1439US2013009297A1Semiconductor device package having configurable lead frame fingersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 1539US2013009296A1Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 1639US2011291254A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsHARNDEN JAMES·Filed 2011·Application pending·0 cites
- 1734US2012181677A1Semiconductor device package with two component lead frameTSUI ANTHONY C·Filed 2012·Application pending·0 cites
- 1834US2012181676A1Power semiconductor device packagingTSUI ANTHONY C·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Anthony C. Tsui files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →