Inventor · disambiguated record

Arito Ogawa

Also filed as: OGAWA ARITO

58 granted patents·39 pending applications·66 citations·filing 2002–2025

97Inventor score

Technology areasH10P H10D H10W C23C

Files withKOKUSAI ELECTRIC CORP49 HITACHI INT ELECTRIC INC37 OGAWA ARITO4 HITACHI LTD2 SUMITOMO CHEMICAL CO2

Top patents by PatentIndex Score

97 records

0187US9508555B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·8 cites·8 claims
0285US8404603B2Method of manufacturing semiconductor device and substrate processing systemOGAWA ARITO·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
0384US12451360B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
0484US11393719B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC COPORATION·Filed 2020·Granted Jul 19, 2022·2 cites·13 claims
0584US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
0683US8994124B2Semiconductor device, method of manufacturing semiconductor device and system of processing substrateOGAWA ARITO·Filed 2012·Granted Mar 31, 2015·5 cites·20 claims
0782US8951912B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumOGAWA ARITO·Filed 2012·Granted Feb 10, 2015·4 cites·16 claims
0882US2025389026A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
0981US12469707B2Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 11, 2025·0 cites·19 claims
1081US2024267705A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
1180US9472637B2Semiconductor device having electrode made of high work function material and method of manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·17 claims
1279US11915938B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 27, 2024·0 cites·17 claims
1378US9123644B2Semiconductor device, method of manufacturing semiconductor device and system of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 1, 2015·2 cites·20 claims
1477US8937022B2Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatusOGAWA ARITO·Filed 2011·Granted Jan 20, 2015·4 cites·10 claims
1576US10388530B2Method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 20, 2019·1 cites·14 claims
1676US9012323B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 21, 2015·2 cites·15 claims
1775US12148621B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
1874US12084757B2Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 10, 2024·0 cites·17 claims
1974US11538688B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
2074US9425039B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 23, 2016·2 cites·6 claims
2173US9745656B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 29, 2017·1 cites·21 claims
2272US2025022708A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
2372US2025069898A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
2471US11967500B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
2571US10410870B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2019·1 cites·19 claims
2670US12080555B2Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 3, 2024·0 cites·17 claims
2770US11908737B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 20, 2024·0 cites·14 claims
2870US11424127B2Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Aug 23, 2022·0 cites·18 claims
2970US9406520B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 2, 2016·1 cites·11 claims
3070US9378964B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 28, 2016·1 cites·13 claims
3170US9355850B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 31, 2016·1 cites·14 claims
3269US12170206B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 17, 2024·0 cites·9 claims
3368US12421609B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 23, 2025·0 cites·16 claims
3468US9190281B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 17, 2015·1 cites·13 claims
3568US2024344194A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
3667US9059089B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 16, 2015·1 cites·6 claims
3767US8367560B2Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2008·Granted Feb 5, 2013·2 cites·18 claims
3866US9437704B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 6, 2016·1 cites·11 claims
3966US7884423B2Semiconductor device and fabrication method thereofROHM CO LTD·Filed 2008·Granted Feb 8, 2011·2 cites·19 claims
4065US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
4164US11621169B2Method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·0 cites·16 claims
4263US12278108B2Substrate processing method, method of manufacturing semiconductor device, non- transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
4363US12148614B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
4463US12084760B2Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 10, 2024·0 cites·16 claims
4562US10734218B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Aug 4, 2020·0 cites·10 claims
4662US2025011931A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
4762US2025218784A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
4862US2025011926A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
4962US2025011929A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
5060US2025006493A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites

Showing the top 50 of 97 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →