Inventor · disambiguated record
Atsushi Kanda
Also filed as: KANDA ATSUSHI · SATO KYOSHI
36 granted patents·9 pending applications·411 citations·filing 1977–2022
97Inventor score
Files withSEIKO EPSON CORP9NGK SPARK PLUG CO6NIPPON TELEGRAPH & TELEPHONE6KANDA ATSUSHI5FUJISAWA PHARMACEUTICAL CO4
Top patents by PatentIndex Score
45 records- 0195US10144126B2Robot system and method of operating a robot systemAIRBUS OPERATIONS GMBH·Filed 2016·Granted Dec 4, 2018·123 cites·18 claims
- 0289US7285863B2Pad structures including insulating layers having a tapered surfaceSEIKO EPSON CORP·Filed 2004·Granted Oct 23, 2007·35 cites·15 claims
- 0381US6884868B1Cyclic hexapeptides having antibiotic activityFUJISAWA PHARMACEUTICAL CO·Filed 2000·Granted Apr 26, 2005·20 cites·8 claims
- 0481US4262710AOil supply means for tanks containing blended fuel and oilYAMAHA MOTOR CO LTD·Filed 1979·Granted Apr 21, 1981·26 cites·2 claims
- 0579US11635373B2Information processing apparatus, information processing method, program, and monitoring systemJAPAN AEROSPACE EXPLORATION·Filed 2018·Granted Apr 25, 2023·1 cites·20 claims
- 0671US4191866AThree-function switch for a motorcycleYAMAHA MOTOR CO LTD·Filed 1977·Granted Mar 4, 1980·24 cites·5 claims
- 0768US10365206B2Surface condition monitoring apparatusJAPAN AEROSPACE EXPLORATION·Filed 2017·Granted Jul 30, 2019·1 cites·10 claims
- 0868USD622676SLED display deviceNICHIA CORP·Filed 2007·Granted Aug 31, 2010·16 cites·1 claims
- 0966US8174838B2Display device allowing repeated removal and installation of screwKANDA ATSUSHI·Filed 2009·Granted May 8, 2012·5 cites·18 claims
- 1066US6818539B1Semiconductor devices and methods of fabricating the sameSEIKO EPSON CORP·Filed 2000·Granted Nov 16, 2004·9 cites·26 claims
- 1164US11892671B2Light-emitting module and planar light sourceNICHIA CORP·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 1262US4402351AOil supply means for tanks containing blended fuel and oilYAMAHA MOTOR CO LTD·Filed 1981·Granted Sep 6, 1983·16 cites·4 claims
- 1361US4582813ASintered alumina productNGK SPARK PLUG CO·Filed 1984·Granted Apr 15, 1986·16 cites·6 claims
- 1460US11264519B2Light-receiving element and method for manufacturing elementNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Mar 1, 2022·0 cites·6 claims
- 1560US4705102ABoiling refrigerant-type cooling systemFUJI ELECTRIC CO LTD·Filed 1985·Granted Nov 10, 1987·35 cites·3 claims
- 1660US4657825AElectronic component using a silicon carbide substrate and a method of making itNGK SPARK PLUG CO·Filed 1985·Granted Apr 14, 1987·17 cites·16 claims
- 1759US6780701B2Method for manufacturing high-breakdown voltage transistor and low-breakdown voltage transistor on the same substrateSEIKO EPSON CORP·Filed 2002·Granted Aug 24, 2004·7 cites·11 claims
- 1852US12467236B2Work machineHITACHI CONSTRUCTION MACH CO·Filed 2020·Granted Nov 11, 2025·0 cites·5 claims
- 1952US9957073B2Bag sealing tape, and banding device and banding method using the bag sealing tapeKYOWA LTD·Filed 2017·Granted May 1, 2018·0 cites·6 claims
- 2052US4723863AMethod and means for joining a ceramic shaft and metal sleeveNGK SPARK PLUG CO·Filed 1986·Granted Feb 9, 1988·11 cites·2 claims
- 2150US12425105B2Optical burst transmitterNIPPON TELEGRAPH & TELEPHONE·Filed 2020·Granted Sep 23, 2025·0 cites·7 claims
- 2250US2008048334A1Semiconductor devices and methods of fabricating the sameKANDA ATSUSHI·Filed 2007·Application pending·0 cites
- 2350US2008042298A1Semiconductor devices and methods of fabricating the sameKANDA ATSUSHI·Filed 2007·Application pending·0 cites
- 2450US2008258298A1Semiconductor devices and methods of fabricating the sameKANDA ATSUSHI·Filed 2007·Application pending·0 cites
- 2549US12000780B2Information processing system, information processing device, information processing method, and programJAPAN AEROSPACE EXPLORATION·Filed 2020·Granted Jun 4, 2024·0 cites·13 claims
- 2649US6720222B2Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2002·Granted Apr 13, 2004·5 cites·8 claims
- 2749US6638804B2Method of manufacturing semiconductor device with high and low breakdown transistorsSEIKO EPSON CORP·Filed 2002·Granted Oct 28, 2003·5 cites·5 claims
- 2849US2008064169A1Method for manufacturing semiconductor device, and semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 2949US2008061380A1Method for manufacturing semiconductor device, and semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 3046US7187227B2Driver circuitNIPPON TELEGRAPH & TELEPHONE·Filed 2003·Granted Mar 6, 2007·4 cites·7 claims
- 3146US5656113AMethod of manufacturing a multilayered wiring substrate of aluminum nitride having a high dielectric layerNGK SPARK PLUG CO·Filed 1995·Granted Aug 12, 1997·11 cites·14 claims
- 3246US5589429AAluminum nitride sintered body and process for producing the sameNGK SPARK PLUG CO·Filed 1994·Granted Dec 31, 1996·10 cites·7 claims
- 3346US2014253308A1Vehicular emergency report apparatusDENSO CORP·Filed 2014·Application pending·0 cites
- 3445US6355800B1Process for producing aminopiperazine derivativesFUJISAWA PHARMACEUTICAL CO·Filed 1998·Granted Mar 12, 2002·3 cites·2 claims
- 3544US12152374B2Construction machineHITACHI CONSTRUCTION MACH CO·Filed 2019·Granted Nov 26, 2024·0 cites·7 claims
- 3644US8714707B2Method of making hole in substrate, substrate, nozzle plate and ink jet headKANDA ATSUSHI·Filed 2012·Granted May 6, 2014·0 cites·6 claims
- 3744US2024222532A1Light-Receiving Element and Light Receiving CircuitNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
- 3844US2012079793A1Bag Sealing Tape, and Banding Device and Banding Method Using the Bag Sealing TapeOUE HIDEKAZU·Filed 2011·Application pending·0 cites
- 3943US12243862B2Optical receiving circuitNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Mar 4, 2025·0 cites·11 claims
- 4043US5709928AMultilayered wiring substrate of aluminum nitride having a high dielectric layer and method of manufacture thereofNGK SPARK PLUG CO·Filed 1994·Granted Jan 20, 1998·10 cites·5 claims
- 4142US6455726B2Manufacturing methodFUJISAWA PHARMACEUTICAL CO·Filed 2001·Granted Sep 24, 2002·0 cites·6 claims
- 4240US7511539B2Driver circuitNIPPON TELEGRAPH & TELEPHONE·Filed 2007·Granted Mar 31, 2009·0 cites·3 claims
- 4338US2004256677A1Method for manufacturing semiconductor device, and semiconductor deviceSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 4436US6291680B1Production processFUJISAWA PHARMACEUTICAL CO·Filed 1998·Granted Sep 18, 2001·1 cites·5 claims
- 4531US6916714B2Method of manufacturing a semiconductor device, in which a high-breakdown-voltage mos transistor and a low-breakdown-voltage mos transistor are formed on an identical semiconductor substrate and semiconductor device manufactured therebySEIKO EPSON CORP·Filed 2002·Granted Jul 12, 2005·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →