Inventor · disambiguated record

Bernhard Goller

Also filed as: GOLLER BERNHARD

42 granted patents·9 pending applications·122 citations·filing 2011–2025

97Inventor score

Technology areasH10P H01M H10W G06K H10D

Files withINFINEON TECHNOLOGIES AG42 INFINEON TECHNOLOGIES AUSTRIA AG7 FORSTER MAGDALENA1 INFINEON TECHNOLOGIES AUSTRIA1

Top patents by PatentIndex Score

51 records

0194US10573742B1Oxygen inserted Si-layers in vertical trench power devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 25, 2020·11 cites·24 claims
0293US9355881B2Semiconductor device including a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 31, 2016·38 cites·22 claims
0392US10903078B2Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·9 cites·28 claims
0492US10784161B2Semiconductor chip including self-aligned, back-side conductive layer and method for making the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 22, 2020·7 cites·8 claims
0591US10580888B1Oxygen inserted Si-layers for reduced contact implant outdiffusion in vertical power devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Mar 3, 2020·7 cites·22 claims
0690US11031466B2Method of forming oxygen inserted Si-layers in power semiconductor devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jun 8, 2021·2 cites·20 claims
0789US11476111B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 18, 2022·2 cites·13 claims
0889US10741638B2Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devicesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Aug 11, 2020·4 cites·13 claims
0989US9886660B2Semiconductor device having one or more of a shock sensor and an acceleration sensorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 6, 2018·6 cites·6 claims
1087US11742215B2Methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 29, 2023·1 cites·16 claims
1186US10861966B2Vertical trench power devices with oxygen inserted Si-layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Dec 8, 2020·3 cites·20 claims
1286US9614256B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·4 cites·14 claims
1384US12412740B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
1483US10714377B2Semiconductor device and semiconductor wafer including a porous layer and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 14, 2020·3 cites·39 claims
1582US10433736B2Implantable vessel fluid sensorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 8, 2019·5 cites·6 claims
1680US9269961B2Lithium battery, method for manufacturing a lithium battery, integrated circuit and method of manufacturing an integrated circuitINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted Feb 23, 2016·4 cites·20 claims
1780US8785034B2Lithium battery, method for manufacturing a lithium battery, integrated circuit and method of manufacturing an integrated circuitFORSTER MAGDALENA·Filed 2011·Granted Jul 22, 2014·7 cites·27 claims
1879US11404262B2Method for partially removing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 2, 2022·2 cites·24 claims
1979US9929438B2Method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·1 cites·20 claims
2077US12211703B2Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
2177US11881397B2Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
2277US9917333B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 13, 2018·2 cites·20 claims
2373US10199255B2Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuckINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 5, 2019·2 cites·20 claims
2468US11088009B2Support table, support table assembly, processing arrangement, and methods thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 10, 2021·1 cites·24 claims
2567US11810779B2Method of porosifying part of a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Granted Nov 7, 2023·0 cites·22 claims
2667US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
2767US2023330769A1Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
2866US12249504B2Manufacturing and reuse of semiconductor substratesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Mar 11, 2025·0 cites·29 claims
2966US2025183031A1Method of processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
3065US11328955B2Semiconductor chip including back-side conductive layerINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·22 claims
3163US11712749B2Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·26 claims
3262US10868172B2Vertical power devices with oxygen inserted Si-layersINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Dec 15, 2020·0 cites·23 claims
3356US2024030032A1Method for manufacturing a contact on a silicon carbide semiconductor substrate, and silicon carbide semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
3453US9489607B2Semiconductor device and an identification tagINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 8, 2016·0 cites·7 claims
3553US2024006218A1Method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
3652US11139375B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
3752US9531035B2Lithium battery, method for manufacturing a lithium battery, integrated circuit and method of manufacturing an integrated circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Dec 27, 2016·0 cites·18 claims
3852US2023238442A1Semiconductor device with metal nitride layer and a method of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
3951US10170746B2Battery electrode, battery, and method for manufacturing a battery electrodeINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jan 1, 2019·0 cites·24 claims
4050US2025253168A1Apparatus for Electrochemical Treating of a Semiconductor Substrate and a Process using the ApparatusINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
4149US9627670B2Battery cell and method for making battery cellINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·0 cites·19 claims
4249US2015147850A1Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
4349US2021391377A1Method of thinning a semiconductor substrate to high evenness and semiconductor substrate having a device layer of high evennessINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
4448US10530018B2Panel, a method for fabricating a panel and a methodINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 7, 2020·0 cites·20 claims
4547US10749216B2Battery, integrated circuit and method of manufacturing a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 18, 2020·0 cites·20 claims
4646US2021391218A1Semiconductor device manufacturing by thinning and dicingINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
4744US11373857B2Semiconductor surface smoothing and semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 28, 2022·0 cites·18 claims
4841US12060266B2Method with mechanical dicing process for producing MEMS componentsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 13, 2024·0 cites·21 claims
4940US10439062B2Metallization layers for semiconductor devices and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 8, 2019·0 cites·24 claims
5039US9862037B2Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuckINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims

Showing the top 50 of 51 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →