Inventor · disambiguated record
Bora Baloglu
Also filed as: BALOGLU BORA
30 granted patents·7 pending applications·113 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
37 records- 0196US9559075B1Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 31, 2017·20 cites·20 claims
- 0295US10410999B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·14 cites·18 claims
- 0395US8986806B1Warpage control stiffener ring package and fabrication methodBALOGLU BORA·Filed 2012·Granted Mar 24, 2015·35 cites·23 claims
- 0493US9905440B1Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2016·Granted Feb 27, 2018·8 cites·20 claims
- 0591US10504827B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 10, 2019·6 cites·7 claims
- 0690US9607890B1Stress relieving through-silicon viasAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 28, 2017·9 cites·20 claims
- 0786US11823913B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Nov 21, 2023·1 cites·20 claims
- 0885US11901343B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
- 0984US11031259B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·2 cites·20 claims
- 1083US11444013B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Sep 13, 2022·2 cites·20 claims
- 1182US10468272B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 1282US2024087914A1Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 1381US12221339B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 11, 2025·0 cites·19 claims
- 1480US2024290761A1Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1579US10438910B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 8, 2019·2 cites·20 claims
- 1678US11784101B2Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Oct 10, 2023·1 cites·20 claims
- 1773US11897761B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·0 cites·15 claims
- 1873US2025153999A1Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1972US12015000B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2070US9349613B1Electronic package with embedded materials in a molded structure to control warpage and stressBALOGLU BORA·Filed 2012·Granted May 24, 2016·3 cites·16 claims
- 2169US10134635B1Stress relieving through-silicon viasAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 2269US10032726B1Embedded vibration management systemAMKOR TECHNOLOGY INC·Filed 2013·Granted Jul 24, 2018·2 cites·23 claims
- 2369US9741617B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·1 cites·20 claims
- 2469US2024038606A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 2567US9269872B1Molded electronic package geometry to control warpage and die stressBALOGLU BORA·Filed 2012·Granted Feb 23, 2016·2 cites·18 claims
- 2662US11018102B2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 2762US10985146B2Semiconductor device with integrated heat distribution and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2859US11352252B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 7, 2022·0 cites·12 claims
- 2959US2021217631A1Electronic device with adaptive vertical interconnect and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Application pending·0 cites
- 3058US8940587B1Die seal design and method and apparatus for integrated circuit productionBALOGLU BORA·Filed 2012·Granted Jan 27, 2015·1 cites·23 claims
- 3156US10062611B2Encapsulated semiconductor package and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 3255US10861798B2Embedded vibration management system having an array of vibration absorbing structuresAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 3354US10790161B2Electronic device with adaptive vertical interconnect and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 29, 2020·0 cites·23 claims
- 3453US11605552B2Hybrid panel method of manufacturing electronic devices and electronic devices manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Mar 14, 2023·0 cites·17 claims
- 3552US2024274445A1Hybrid panel method of manufacturing electronic devices and electronic devices manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3650US11915949B2Hybrid panel method of manufacturing electronic devices and electronic devices manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 3744US2016172214A1Molded Electronic Package Geometry To Control Warpage And Die StressAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bora Baloglu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →