Inventor · disambiguated record
Bryan Black
Also filed as: BLACK BRYAN · BLACK BRYAN JOSEPH
26 granted patents·17 pending applications·222 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0195US8193039B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2010·Granted Jun 5, 2012·22 cites·19 claims
- 0294US8691626B2Semiconductor chip device with underfillSU MICHAEL Z·Filed 2010·Granted Apr 8, 2014·24 cites·21 claims
- 0394US8472190B2Stacked semiconductor chip device with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jun 25, 2013·24 cites·24 claims
- 0493US8338961B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2012·Granted Dec 25, 2012·15 cites·21 claims
- 0591US8866276B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2013·Granted Oct 21, 2014·11 cites·20 claims
- 0691US8451014B2Die stacking, testing and packaging for yieldBLACK BRYAN·Filed 2010·Granted May 28, 2013·14 cites·23 claims
- 0791US8034662B2Thermal interface material with support structureADVANCED MICRO DEVICES INC·Filed 2009·Granted Oct 11, 2011·20 cites·19 claims
- 0890US9437561B2Semiconductor chip with redundant thru-silicon-viasBLACK BRYAN·Filed 2010·Granted Sep 6, 2016·12 cites·17 claims
- 0990US9385055B2Stacked semiconductor chips with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jul 5, 2016·13 cites·17 claims
- 1085US8574965B2Semiconductor chip device with liquid thermal interface materialREFAI-AHMED GAMAL·Filed 2010·Granted Nov 5, 2013·8 cites·23 claims
- 1184US9806014B2Interposer with beyond reticle field conductor padsALFANO MICHAEL S·Filed 2016·Granted Oct 31, 2017·8 cites·15 claims
- 1284US8726139B2Unified data masking, data poisoning, and data bus inversion signalingO'CONNOR JAMES·Filed 2011·Granted May 13, 2014·7 cites·16 claims
- 1382US11602406B1System and method for rapidly accessing an improved tourniquetBLACK BRYAN·Filed 2020·Granted Mar 14, 2023·1 cites·7 claims
- 1482US8704353B2Thermal management of stacked semiconductor chips with electrically non-functional interconnectsSU MICHAEL·Filed 2012·Granted Apr 22, 2014·7 cites·24 claims
- 1581US9793239B2Semiconductor workpiece with selective backside metallizationSU MICHAEL Z·Filed 2015·Granted Oct 17, 2017·3 cites·22 claims
- 1681US8909840B2Data bus inversion codingNYGREN AARON J·Filed 2011·Granted Dec 9, 2014·7 cites·20 claims
- 1781US8394672B2Method of manufacturing and assembling semiconductor chips with offset padsSU MICHAEL Z·Filed 2010·Granted Mar 12, 2013·5 cites·14 claims
- 1878US8796842B2Stacked semiconductor chip device with thermal management circuit boardREFAI-AHMED GAMAL·Filed 2010·Granted Aug 5, 2014·5 cites·25 claims
- 1975US12094853B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 2075US8617926B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2010·Granted Dec 31, 2013·3 cites·23 claims
- 2175US7631439B2Reference chart apparatusBLACK BRYAN JOSEPH·Filed 2008·Granted Dec 15, 2009·10 cites·13 claims
- 2275US2025293133A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 2368US11469212B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2016·Granted Oct 11, 2022·1 cites·20 claims
- 2467US2023343687A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 2561US9263364B2Thermal interface material with support structureTOUZELBAEV MAXAT·Filed 2011·Granted Feb 16, 2016·1 cites·20 claims
- 2658US2025210548A1Embedded voltage regulation moduleCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 2755US9627281B2Semiconductor chip with thermal interface tapePREJEAN SETH·Filed 2010·Granted Apr 18, 2017·1 cites·16 claims
- 2853US2024120293A1Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in SubstratesCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 2952US2024258041A1Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive InksCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 3051US2024337799A1Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 3151US2023395305A1Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 3250US10842501B2System and method for rapidly accessing an improved tourniquetBLACK BRYAN·Filed 2017·Granted Nov 24, 2020·0 cites·20 claims
- 3350US2013161814A1Semiconductor chip with offset padsSU MICHAEL Z·Filed 2013·Application pending·0 cites
- 3447US2023411174A1Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2022·Application pending·0 cites
- 3540US2013147028A1Heat spreader for multiple chip systemsSU MICHAEL Z·Filed 2011·Application pending·0 cites
- 3640US2013141442A1Method and apparatus for multi-chip processingBROTHERS JOHN W·Filed 2011·Application pending·0 cites
- 3738US10290606B2Interposer with identification systemALFANO MICHAEL·Filed 2012·Granted May 14, 2019·0 cites·19 claims
- 3838US2013256913A1Die stacking with coupled electrical interconnects to align proximity interconnectsBLACK BRYAN·Filed 2012·Application pending·0 cites
- 3938US2013256895A1Stacked semiconductor components with universal interconnect footprintSU MICHAEL·Filed 2012·Application pending·0 cites
- 4033US2013159587A1Interconnect Redundancy for Multi-Interconnect DeviceNYGREN AARON·Filed 2011·Application pending·0 cites
- 4130US2013342231A1Semiconductor substrate with onboard test structureALFANO MICHAEL·Filed 2012·Application pending·0 cites
- 4230US2017092712A1Via capacitorSIEGEL JOSEPH R·Filed 2015·Application pending·0 cites
- 4324US2016329312A1Semiconductor chip with offloaded logicO'MULLAN SEAN M·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →