Inventor · disambiguated record
Byong Jin Kim
Also filed as: KIM BYONG JIN
65 granted patents·20 pending applications·170 citations·filing 2008–2025
98Inventor score
Files withAMKOR TECHNOLOGY INC45AMKOR TECH SINGAPORE HOLDING PTE LTD35BAE JAE MIN2HWANG CHAN HA1KIM BYONG JIN1
Top patents by PatentIndex Score
85 records- 0195US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0295US9631481B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 0395US9613829B1Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 4, 2017·12 cites·20 claims
- 0493US9966652B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·8 cites·22 claims
- 0592US12046798B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 23, 2024·2 cites·16 claims
- 0692US10049954B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 14, 2018·7 cites·14 claims
- 0792US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
- 0892US8921955B1Semiconductor device with micro electromechanical system dieLEE JAE UNG·Filed 2011·Granted Dec 30, 2014·22 cites·20 claims
- 0991US9716071B2Semiconductor device redistribution layer with narrow trace width relative to passivation layer openingAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 25, 2017·12 cites·24 claims
- 1090US11887916B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 30, 2024·2 cites·14 claims
- 1190US11508635B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·2 cites·19 claims
- 1287US11355470B2Semiconductor device and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·16 claims
- 1386US2024404902A1Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1485US11018079B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2017·Granted May 25, 2021·3 cites·13 claims
- 1585US9978695B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted May 22, 2018·1 cites·20 claims
- 1685US9881864B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 30, 2018·3 cites·20 claims
- 1784US12476171B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Nov 18, 2025·0 cites·15 claims
- 1884US12261145B2Semiconductor device and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 25, 2025·1 cites·16 claims
- 1983US12451441B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
- 2083US11145588B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 2182US12062833B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 2282US10685897B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 16, 2020·2 cites·20 claims
- 2382US9029992B2Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframeAMKOR TECHNOLOGY INC·Filed 2013·Granted May 12, 2015·6 cites·20 claims
- 2482US2024258225A1Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2581US11355449B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 2681US2025309070A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2780US12431611B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 2880US12062588B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 2980US9275939B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 1, 2016·4 cites·20 claims
- 3080US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3179US12334420B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 3279US8866278B1Semiconductor device with increased I/O configurationBAE JAE MIN·Filed 2011·Granted Oct 21, 2014·10 cites·20 claims
- 3378US10366943B2Packaged electronic device having stepped conductive structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 30, 2019·4 cites·20 claims
- 3478US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
- 3577US11569163B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 3677US9508631B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 29, 2016·2 cites·20 claims
- 3777US9184148B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
- 3877US8648450B1Semiconductor device including leadframe with a combination of leads and landsBAE JAE MIN·Filed 2011·Granted Feb 11, 2014·4 cites·20 claims
- 3977US8487420B1Package in package semiconductor device with film over wireHWANG CHAN HA·Filed 2008·Granted Jul 16, 2013·10 cites·18 claims
- 4075US9809446B1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 7, 2017·2 cites·22 claims
- 4175US9653336B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 16, 2017·2 cites·20 claims
- 4275US9431334B2Semiconductor device having single layer substrate and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·20 claims
- 4373US10468343B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 5, 2019·1 cites·20 claims
- 4472US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4572US11961794B2Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 4672US11908779B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 4772US9552999B2Packaged electronic device having reduced parasitic effects and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·2 cites·20 claims
- 4872US8604625B1Semiconductor device having conductive pads to prevent solder reflowKIM BYONG JIN·Filed 2010·Granted Dec 10, 2013·4 cites·20 claims
- 4972US2024387333A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 5071US11677135B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →