Inventor · disambiguated record
Carsten Von Koblinski
Also filed as: VON KOBLINSKI CARSTEN · VON KOBLINSKI CARSTEN JOACHIM
49 granted patents·10 pending applications·261 citations·filing 1999–2025
97Inventor score
Files withINFINEON TECHNOLOGIES AG37INFINEON TECHNOLOGIES AUSTRIA AG7VON KOBLINSKI CARSTEN5INFINEON TECHNOLOGIES AUSTRIA3BREYMESSER ALEXANDER2
Top patents by PatentIndex Score
59 records- 0196US7202107B2Method for producing a semiconductor component with a plastic housing and carrier plate for performing the methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 10, 2007·108 cites·9 claims
- 0294US7767495B2Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 3, 2010·31 cites·21 claims
- 0393US7622733B2Semiconductor structure with a plastic housing and separable carrier plateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 24, 2009·32 cites·18 claims
- 0489US8202786B2Method for manufacturing semiconductor devices having a glass substrateVON KOBLINSKI CARSTEN·Filed 2010·Granted Jun 19, 2012·11 cites·17 claims
- 0587US8546934B2Method for manufacturing semiconductor devices having a glass substrateVON KOBLINSKI CARSTEN·Filed 2012·Granted Oct 1, 2013·9 cites·3 claims
- 0683US11302579B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·1 cites·5 claims
- 0783US10615040B2Superjunction structure in a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·3 cites·11 claims
- 0883US2025376370A1Mems sensor with particle filter and method for producing itINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0982US10433736B2Implantable vessel fluid sensorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 8, 2019·5 cites·6 claims
- 1081US8552829B2Transformer device and method for manufacturing a transformer deviceKROENER FRIEDRICH·Filed 2010·Granted Oct 8, 2013·6 cites·4 claims
- 1179US10672664B2Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 2, 2020·2 cites·14 claims
- 1278US10112861B2Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·1 cites·21 claims
- 1378US9601376B2Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 21, 2017·2 cites·23 claims
- 1477US12094837B2Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection materialINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1577US2024371793A1Semiconductor device having a backside metallization layer and a protection layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1676US9391263B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 1775US8841768B2Chip package and a method for manufacturing a chip packageVON KOBLINSKI CARSTEN·Filed 2012·Granted Sep 23, 2014·5 cites·26 claims
- 1875US8803312B2Method for manufacturing semiconductor devices having a glass substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 12, 2014·3 cites·7 claims
- 1974US11848237B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 2074US9847235B2Semiconductor device with plated lead frame, and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 19, 2017·3 cites·22 claims
- 2174US9219020B2Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devicesBREYMESSER ALEXANDER·Filed 2012·Granted Dec 22, 2015·3 cites·24 claims
- 2271US9981844B2Method of manufacturing semiconductor device with glass piecesBREYMESSER ALEXANDER·Filed 2012·Granted May 29, 2018·3 cites·6 claims
- 2370US12087717B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 10, 2024·0 cites·23 claims
- 2470US10128204B2RF moduleINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·1 cites·25 claims
- 2569US11605599B2Semiconductor device having a thin semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 14, 2023·0 cites·11 claims
- 2669US8025783B2Method for producing a composite material, associated composite material and associated semiconductor circuit arrangementsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 27, 2011·3 cites·28 claims
- 2769US7460704B2Device for stabilizing a workpiece during processingINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 2, 2008·4 cites·21 claims
- 2868US10332814B2Bonded system and a method for adhesively bonding a hygroscopic materialINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 25, 2019·2 cites·18 claims
- 2967US2025183210A1Semiconductor device and package including the semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 3067US2019023600A1Method of Manufacturing a Plurality of Glass Members, a Method of Manufacturing an Optical Member, and Array of Glass Members in a Glass SubstrateINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3167US2023411336A1Semiconductor wafer, clip and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 3266US2022246745A1Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3365US12415719B2MEMS sensor with particle filter and method for producing itINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 16, 2025·0 cites·19 claims
- 3465US2022293558A1Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3563US11342433B2Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 24, 2022·0 cites·15 claims
- 3661US12255162B2Semiconductor device, semiconductor component and method of fabricating a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Mar 18, 2025·0 cites·20 claims
- 3761US9117801B2Semiconductor devices having a glass substrate, and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 25, 2015·1 cites·23 claims
- 3861US2025096101A1Chip-substrate composite semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3960US11756917B2Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Sep 12, 2023·0 cites·16 claims
- 4060US8102045B2Integrated circuit with galvanically bonded heat sinkVON KOBLINSKI CARSTEN·Filed 2007·Granted Jan 24, 2012·2 cites·15 claims
- 4159US11081457B2Semiconductor package and methods of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·0 cites·26 claims
- 4259US8865522B2Method for manufacturing semiconductor devices having a glass substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 21, 2014·1 cites·23 claims
- 4358US11069639B2Semiconductor module, electronic component and method of manufacturing a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Jul 20, 2021·0 cites·12 claims
- 4458US9608201B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 28, 2017·0 cites·18 claims
- 4558US9245684B2Method for manufacturing a transformer device on a glass substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jan 26, 2016·0 cites·10 claims
- 4657US11322400B2Roughening of a metallization layer on a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 4757US2017148981A1Semiconductor Devices Having Insulating Substrates and Methods of Formation ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4856US6756505B1Metallocene complexesBASELL POLOLEFINE GMBH·Filed 1999·Granted Jun 29, 2004·17 cites·9 claims
- 4953US11393784B2Semiconductor package devices and method for forming semiconductor package devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 19, 2022·0 cites·20 claims
- 5053US11148943B2Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass piecesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →