Inventor · disambiguated record
Charles L. Arvin
Also filed as: ARVIN CHARLES L · ARVIN CHARLES LEON
152 granted patents·13 pending applications·496 citations·filing 2001–2024
99Inventor score
Top patents by PatentIndex Score
165 records- 0199US9853006B2Semiconductor device contact structure having stacked nickel, copper, and tin layersGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 26, 2017·47 cites·17 claims
- 0298US10535608B1Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrateIBM·Filed 2018·Granted Jan 14, 2020·86 cites·19 claims
- 0398US9396991B2Multilayered contact structure having nickel, copper, and nickel-iron layersGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 19, 2016·46 cites·15 claims
- 0497US9997424B2Method of forming a temporary test structure for device fabricationIBM·Filed 2017·Granted Jun 12, 2018·18 cites·11 claims
- 0597US9401336B2Dual layer stack for contact formationIBM·Filed 2014·Granted Jul 26, 2016·48 cites·17 claims
- 0696US10804204B2Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrateIBM·Filed 2019·Granted Oct 13, 2020·19 cites·19 claims
- 0796US9911708B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted Mar 6, 2018·9 cites·20 claims
- 0896US9799618B1Mixed UBM and mixed pitch on a single dieIBM·Filed 2016·Granted Oct 24, 2017·9 cites·7 claims
- 0996US8177945B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2007·Granted May 15, 2012·17 cites·20 claims
- 1095US11235404B2Personalized copper block for selective solder removalIBM·Filed 2020·Granted Feb 1, 2022·4 cites·14 claims
- 1195US9679806B1Nanowires for pillar interconnectsIBM·Filed 2016·Granted Jun 13, 2017·11 cites·7 claims
- 1295US9583451B2Conductive pillar shaped for solder confinementIBM·Filed 2015·Granted Feb 28, 2017·8 cites·19 claims
- 1393US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 1493US8298930B2Undercut-repair of barrier layer metallurgy for solder bumps and methods thereofARVIN CHARLES L·Filed 2010·Granted Oct 30, 2012·16 cites·19 claims
- 1592US10600751B2Conductive pillar shaped for solder confinementIBM·Filed 2019·Granted Mar 24, 2020·4 cites·20 claims
- 1692US10041183B2Electrodeposition systems and methods that minimize anode and/or plating solution degradationGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 7, 2018·2 cites·19 claims
- 1791US9741682B2Structures to enable a full intermetallic interconnectIBM·Filed 2015·Granted Aug 22, 2017·6 cites·6 claims
- 1891US9084378B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2013·Granted Jul 14, 2015·11 cites·16 claims
- 1989US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 2088US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 2187US11282773B2Enlarged conductive pad structures for enhanced chip bond assembly yieldIBM·Filed 2020·Granted Mar 22, 2022·2 cites·13 claims
- 2287US10790253B2Conductive pillar shaped for solder confinementIBM·Filed 2019·Granted Sep 29, 2020·2 cites·20 claims
- 2387US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 2487US9735071B2Method of forming a temporary test structure for device fabricationIBM·Filed 2015·Granted Aug 15, 2017·4 cites·11 claims
- 2586US11152282B1Localized catalyst for enhanced thermal interface material heat transferIBM·Filed 2020·Granted Oct 19, 2021·2 cites·20 claims
- 2684US10290599B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted May 14, 2019·2 cites·10 claims
- 2784US9565777B1Security mesh and method of makingIBM·Filed 2015·Granted Feb 7, 2017·4 cites·15 claims
- 2884US9359687B1Separation of alpha emitting species from plating bathsIBM·Filed 2015·Granted Jun 7, 2016·2 cites·4 claims
- 2983US9601423B1Under die surface mounted electrical elementsIBM·Filed 2015·Granted Mar 21, 2017·4 cites·15 claims
- 3083US9466547B1Passivation layer topographyGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·4 cites·17 claims
- 3182US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 3281US9324669B2Use of electrolytic plating to control solder wettingIBM·Filed 2014·Granted Apr 26, 2016·5 cites·16 claims
- 3381US8742578B2Solder volume compensation with C4 processARVIN CHARLES L·Filed 2012·Granted Jun 3, 2014·6 cites·10 claims
- 3481US8232655B2Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2008·Granted Jul 31, 2012·9 cites·20 claims
- 3580US10756041B1Finned contactIBM·Filed 2019·Granted Aug 25, 2020·3 cites·20 claims
- 3679US10718062B2Prevent and remove organics from reservoir wellsIBM·Filed 2019·Granted Jul 21, 2020·0 cites·12 claims
- 3779US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 3878US10622299B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2019·Granted Apr 14, 2020·1 cites·20 claims
- 3978US10450667B2System for treating solution for use in electroplating application and method for treating solution for use in electroplating applicationIBM·Filed 2014·Granted Oct 22, 2019·1 cites·14 claims
- 4078US10192839B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted Jan 29, 2019·1 cites·10 claims
- 4178US9574283B2Rinsing and drying for electrochemical processingIBM·Filed 2015·Granted Feb 21, 2017·1 cites·15 claims
- 4278US8784618B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2010·Granted Jul 22, 2014·1 cites·9 claims
- 4377US10586782B2Lead-free solder joining of electronic structuresIBM·Filed 2017·Granted Mar 10, 2020·2 cites·25 claims
- 4477US10249586B2Mixed UBM and mixed pitch on a single dieIBM·Filed 2017·Granted Apr 2, 2019·1 cites·14 claims
- 4577US9933577B2Photonics chipGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 3, 2018·2 cites·17 claims
- 4676US10895017B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Jan 19, 2021·0 cites·18 claims
- 4776US10833051B2Precision alignment of multi-chip high density interconnectsIBM·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
- 4876US10392720B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Aug 27, 2019·0 cites·12 claims
- 4976US9481940B2Electrodeposition system and method incorporating an anode having a back side capacitive elementIBM·Filed 2014·Granted Nov 1, 2016·1 cites·17 claims
- 5075US10756031B1Decoupling capacitor stiffenerIBM·Filed 2019·Granted Aug 25, 2020·2 cites·18 claims
Showing the top 50 of 165 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →