Inventor · disambiguated record
Chien-Huei Chen
Also filed as: CHEN CHIEN-HUEI · CHEN CHIEN-HUEI ADAM
27 granted patents·5 pending applications·259 citations·filing 2003–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11KLA TENCOR CORP7CHEN CHIEN-HUEI3CHEN CHIEN-HUEI ADAM3KLA TENCOR TECH CORP3
Top patents by PatentIndex Score
32 records- 0194US11231376B2Method for semiconductor wafer inspection and system thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·20 claims
- 0294US8781781B2Dynamic care areasKULKARNI ASHOK V·Filed 2011·Granted Jul 15, 2014·20 cites·16 claims
- 0393US8611639B2Semiconductor device property extraction, generation, visualization, and monitoring methodsKULKARNI ASHOK·Filed 2007·Granted Dec 17, 2013·33 cites·38 claims
- 0491US8135204B1Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipeCHEN CHIEN-HUEI ADAM·Filed 2007·Granted Mar 13, 2012·33 cites·26 claims
- 0590US10482590B2Method and system for defect classificationKLA TENCOR CORP·Filed 2017·Granted Nov 19, 2019·11 cites·15 claims
- 0689US8502146B2Methods and apparatus for classification of defects using surface height attributesCHEN CHIEN-HUEI·Filed 2011·Granted Aug 6, 2013·13 cites·20 claims
- 0789US7440607B1Outlier substrate inspectionKLA TENCOR CORP·Filed 2004·Granted Oct 21, 2008·45 cites·20 claims
- 0888US9262821B2Inspection recipe setup from reference image variationKLA TENCOR CORP·Filed 2015·Granted Feb 16, 2016·8 cites·38 claims
- 0987US12068207B2Simultaneous multi-bandwidth optical inspection of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 1087US8000922B2Methods and systems for generating information to be used for selecting values for one or more parameters of a detection algorithmKLA TENCOR CORP·Filed 2008·Granted Aug 16, 2011·16 cites·20 claims
- 1185US10964014B2Defect detecting method and defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 30, 2021·2 cites·20 claims
- 1284US9483819B2Contour-based array inspection of patterned defectsKLA TENCOR CORP·Filed 2013·Granted Nov 1, 2016·6 cites·18 claims
- 1383US2025315942A1Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1482US9898811B2Method and system for defect classificationKLA TENCOR CORP·Filed 2015·Granted Feb 20, 2018·4 cites·13 claims
- 1581US9170211B2Design-based inspection using repeating structuresKULKARNI ASHOK V·Filed 2012·Granted Oct 27, 2015·5 cites·35 claims
- 1680US8139844B2Methods and systems for determining a defect criticality index for defects on wafersCHEN CHIEN-HUEI ADAM·Filed 2008·Granted Mar 20, 2012·11 cites·19 claims
- 1779US12387318B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1879US8669523B2Contour-based defect detection using an inspection apparatusCHEN CHIEN-HUEI·Filed 2012·Granted Mar 11, 2014·5 cites·10 claims
- 1978US10809635B2Defect inspection method and defect inspection systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·2 cites·20 claims
- 2078US7925072B2Methods for identifying array areas in dies formed on a wafer and methods for setting up such methodsKLA TENCOR TECH CORP·Filed 2007·Granted Apr 12, 2011·11 cites·9 claims
- 2177US6985220B1Interactive threshold tuningKLA TENCOR TECH CORP·Filed 2003·Granted Jan 10, 2006·26 cites·19 claims
- 2272US2024363451A1Simultaneous multi-bandwidth optical inspection of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2367US11900586B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·20 claims
- 2464US7894659B2Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a waferKLA TENCOR TECH CORP·Filed 2007·Granted Feb 22, 2011·3 cites·17 claims
- 2560US8213705B2Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a waferCHEN CHIEN-HUEI ADAM·Filed 2011·Granted Jul 3, 2012·1 cites·20 claims
- 2658US2025327859A1Systems and methods for automated analysis of voltage contrast defects in integrated circuit inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2754US10872406B2Hot spot defect detecting method and hot spot defect detecting systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 2851US2023411224A1System and method for detecting defects on a wafer and related non-transitory computer-readable mediumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2947US9489599B2Decision tree construction for automatic classification of defects on semiconductor wafersKLA TENCOR CORP·Filed 2014·Granted Nov 8, 2016·0 cites·33 claims
- 3038US9360863B2Data perturbation for wafer inspection or metrology setup using a model of a differenceTHATTAISUNDARAM GOVIND·Filed 2011·Granted Jun 7, 2016·0 cites·39 claims
- 3138US2012223227A1Apparatus and methods for real-time three-dimensional sem imaging and viewing of semiconductor wafersCHEN CHIEN-HUEI·Filed 2011·Application pending·0 cites
- 3236US9053390B2Automated inspection scenario generationMAHADEVAN MOHAN·Filed 2012·Granted Jun 9, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →