Inventor · disambiguated record
Chien-Kang Chou
Also filed as: CHOU CHIEN K · CHOU CHIEN-KANG
63 granted patents·8 pending applications·1,302 citations·filing 1995–2013
99Inventor score
Top patents by PatentIndex Score
71 records- 0199US7969006B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Jun 28, 2011·96 cites·46 claims
- 0297US8021918B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Sep 20, 2011·45 cites·34 claims
- 0396US8004092B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2008·Granted Aug 23, 2011·42 cites·42 claims
- 0496US7582556B2Circuitry component and method for forming the sameMEGICA CORP·Filed 2006·Granted Sep 1, 2009·40 cites·31 claims
- 0596US7473999B2Semiconductor chip and process for forming the sameMEGICA CORP·Filed 2006·Granted Jan 6, 2009·40 cites·20 claims
- 0696US7468545B2Post passivation structure for a semiconductor device and packaging process for sameMEGICA CORP·Filed 2006·Granted Dec 23, 2008·40 cites·23 claims
- 0796US7397121B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2005·Granted Jul 8, 2008·49 cites·20 claims
- 0895US7470927B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2006·Granted Dec 30, 2008·30 cites·20 claims
- 0994US8362588B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2011·Granted Jan 29, 2013·14 cites·30 claims
- 1094US8004083B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Aug 23, 2011·19 cites·24 claims
- 1194US7989954B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Aug 2, 2011·21 cites·44 claims
- 1294US7271489B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2004·Granted Sep 18, 2007·69 cites·58 claims
- 1393US8884433B2Circuitry component and method for forming the sameLIN MOU-SHIUNG·Filed 2009·Granted Nov 11, 2014·23 cites·22 claims
- 1493US7208834B2Bonding structure with pillar and capMEGICA CORP·Filed 2004·Granted Apr 24, 2007·59 cites·32 claims
- 1592US7470997B2Wirebond pad for semiconductor chip or waferMEGICA CORP·Filed 2004·Granted Dec 30, 2008·66 cites·20 claims
- 1692US7452803B2Method for fabricating chip structureMEGICA CORP·Filed 2005·Granted Nov 18, 2008·20 cites·21 claims
- 1792US6784087B2Method of fabricating cylindrical bonding structureMEGIC CORP·Filed 2002·Granted Aug 31, 2004·60 cites·23 claims
- 1891US8618580B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2013·Granted Dec 31, 2013·8 cites·11 claims
- 1991US8461679B2Method for fabricating circuit componentLEE JIN-YUAN·Filed 2011·Granted Jun 11, 2013·9 cites·22 claims
- 2091US8187965B2Wirebond pad for semiconductor chip or waferLIN MOU-SHIUNG·Filed 2007·Granted May 29, 2012·20 cites·27 claims
- 2191US7960269B2Method for forming a double embossing structureMEGICA CORP·Filed 2006·Granted Jun 14, 2011·21 cites·23 claims
- 2291US7547969B2Semiconductor chip with passivation layer comprising metal interconnect and contact padsMEGICA CORP·Filed 2005·Granted Jun 16, 2009·22 cites·20 claims
- 2390US8836146B2Chip package and method for fabricating the sameCHOU CHIEN-KANG·Filed 2007·Granted Sep 16, 2014·26 cites·48 claims
- 2490US8399989B2Metal pad or metal bump over pad exposed by passivation layerLIN MOU-SHIUNG·Filed 2006·Granted Mar 19, 2013·20 cites·40 claims
- 2590US7960270B2Method for fabricating circuit componentMEGICA CORP·Filed 2007·Granted Jun 14, 2011·14 cites·9 claims
- 2690US7855461B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2008·Granted Dec 21, 2010·19 cites·37 claims
- 2790US7372161B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2004·Granted May 13, 2008·58 cites·33 claims
- 2889US8558383B2Post passivation structure for a semiconductor device and packaging process for sameLIN MOU-SHIUNG·Filed 2008·Granted Oct 15, 2013·16 cites·20 claims
- 2989US7423346B2Post passivation interconnection process and structuresMEGICA CORP·Filed 2004·Granted Sep 9, 2008·48 cites·17 claims
- 3088US8319354B2Semiconductor chip with post-passivation scheme formed over passivation layerLIN MOU-SHIUNG·Filed 2011·Granted Nov 27, 2012·8 cites·33 claims
- 3186US8373202B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Feb 12, 2013·9 cites·16 claims
- 3286US7416971B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2004·Granted Aug 26, 2008·36 cites·18 claims
- 3384US8148822B2Bonding pad on IC substrate and method for making the sameLIN MOU-SHIUNG·Filed 2006·Granted Apr 3, 2012·12 cites·32 claims
- 3484US7482268B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2007·Granted Jan 27, 2009·9 cites·17 claims
- 3584US7381642B2Top layers of metal for integrated circuitsMEGICA CORP·Filed 2004·Granted Jun 3, 2008·29 cites·48 claims
- 3684US7355282B2Post passivation interconnection process and structuresMEGICA CORP·Filed 2004·Granted Apr 8, 2008·31 cites·36 claims
- 3783US7964973B2Chip structureMEGICA CORP·Filed 2008·Granted Jun 21, 2011·8 cites·64 claims
- 3882US8304907B2Top layers of metal for integrated circuitsLIN MOU-SHIUNG·Filed 2007·Granted Nov 6, 2012·8 cites·20 claims
- 3982US7985653B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2008·Granted Jul 26, 2011·8 cites·29 claims
- 4082US7462558B2Method for fabricating a circuit componentMEGICA CORP·Filed 2008·Granted Dec 9, 2008·7 cites·21 claims
- 4179US8552559B2Very thick metal interconnection scheme in IC chipsLIN MOU-SHIUNG·Filed 2005·Granted Oct 8, 2013·9 cites·88 claims
- 4279US7521805B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Apr 21, 2009·7 cites·20 claims
- 4379US7394161B2Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested theretoMEGICA CORP·Filed 2003·Granted Jul 1, 2008·24 cites·43 claims
- 4478US8242601B2Semiconductor chip with passivation layer comprising metal interconnect and contact padsCHOU CHIU-MING·Filed 2009·Granted Aug 14, 2012·7 cites·33 claims
- 4578US7990037B2Carbon nanotube circuit component structureMEGICA CORP·Filed 2006·Granted Aug 2, 2011·6 cites·26 claims
- 4677US8159074B2Chip structureLIN MOU-SHIUNG·Filed 2011·Granted Apr 17, 2012·3 cites·32 claims
- 4775US8198729B2Connection between a semiconductor chip and a circuit component with a large contact areaCHOU CHIU-MING·Filed 2005·Granted Jun 12, 2012·7 cites·29 claims
- 4874US7977803B2Chip structure with bumps and testing padsMEGICA CORP·Filed 2010·Granted Jul 12, 2011·3 cites·20 claims
- 4973US8013449B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2008·Granted Sep 6, 2011·4 cites·20 claims
- 5073US7417317B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Aug 26, 2008·4 cites·38 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →