Inventor · disambiguated record
Chi-Chih Chu
Also filed as: CHU CHI-CHIH
14 granted patents·7 pending applications·557 citations·filing 2003–2014
93Inventor score
Top patents by PatentIndex Score
21 records- 0198US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0296US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 0393US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0493US7417329B2System-in-package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 26, 2008·39 cites·17 claims
- 0592US7473629B2Substrate structure having a solder mask and a process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·30 cites·9 claims
- 0688US8405212B2Semiconductor packageCHU CHI-CHIH·Filed 2010·Granted Mar 26, 2013·16 cites·20 claims
- 0788US8198131B2Stackable semiconductor device packagesWENG CHENG-YI·Filed 2010·Granted Jun 12, 2012·15 cites·20 claims
- 0887US6976781B2Frame and bezel structure for backlight unitAU OPTRONICS CORP·Filed 2003·Granted Dec 20, 2005·42 cites·13 claims
- 0979US7866874B2Backlight module having replaceable light apparatusAU OPTRONICS CORP·Filed 2008·Granted Jan 11, 2011·10 cites·22 claims
- 1075US7187070B2Stacked package moduleADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 6, 2007·22 cites·16 claims
- 1148US2014312496A1Semiconductor package and semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 1245US2013161816A1Semiconductor packageCHU CHI-CHIH·Filed 2013·Application pending·0 cites
- 1344US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 1443US7439619B2Electronic package structure and the packaging process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 21, 2008·0 cites·7 claims
- 1542US2010171206A1Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The SameCHU CHI-CHIH·Filed 2009·Application pending·0 cites
- 1641US6866397B2Leading wire arrangement of a lighting fixture in a back light moduleAU OPTRONICS CORP·Filed 2003·Granted Mar 15, 2005·2 cites·2 claims
- 1739US7126221B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·0 cites·7 claims
- 1839US2008001272A1System-in-package structureCHU CHI-CHIH·Filed 2006·Application pending·0 cites
- 1939US2010237490A1Package structure and manufacturing method thereofCHU CHI-CHIH·Filed 2009·Application pending·0 cites
- 2038US8446546B2Backlight module with bent reflector sheet and display panel deviceHO YA-TING·Filed 2009·Granted May 21, 2013·0 cites·16 claims
- 2137US2005185397A1Direct backlight module and assembly method thereofFiled 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chi-Chih Chu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →