Inventor · disambiguated record
Charles A. Gealer
Also filed as: GEALER CHARLES · GEALER CHARLES A
17 granted patents·6 pending applications·371 citations·filing 1997–2019
94Inventor score
Top patents by PatentIndex Score
23 records- 0198US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0294US9159690B2Tall solders for through-mold interconnectINTEL CORP·Filed 2013·Granted Oct 13, 2015·42 cites·10 claims
- 0391US6750551B1Direct BGA attachment without solder reflowINTEL CORP·Filed 1999·Granted Jun 15, 2004·120 cites·11 claims
- 0490US9666549B2Methods for solder for through-mold interconnectINTEL CORP·Filed 2015·Granted May 30, 2017·10 cites·16 claims
- 0586US10186480B2Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2013·Granted Jan 22, 2019·7 cites·20 claims
- 0681US6043983AEMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 1998·Granted Mar 28, 2000·47 cites·13 claims
- 0780US11217516B2Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameINTEL CORP·Filed 2018·Granted Jan 4, 2022·2 cites·14 claims
- 0873US7166924B2Electronic packages with dice landed on wire bondsINTEL CORP·Filed 2004·Granted Jan 23, 2007·27 cites·20 claims
- 0970US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 1069US9177831B2Die assembly on thin dielectric sheetCHIU CHIA-PIN·Filed 2013·Granted Nov 3, 2015·2 cites·15 claims
- 1166US9617148B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsINTEL CORP·Filed 2016·Granted Apr 11, 2017·1 cites·8 claims
- 1266US6239973B1EMI containment for microprocessor core mounted on a card using surface mounted clipsINTEL CORP·Filed 2000·Granted May 29, 2001·12 cites·16 claims
- 1359US10251273B2Mainboard assembly including a package overlying a die directly attached to the mainboardSEARLS DAMION·Filed 2008·Granted Apr 2, 2019·2 cites·12 claims
- 1454US9820384B2Flexible electronic assembly methodINTEL CORP·Filed 2013·Granted Nov 14, 2017·0 cites·12 claims
- 1553US2010327419A1Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing sameMUTHUKUMAR SRIRAM·Filed 2009·Application pending·0 cites
- 1652US10555417B2Mainboard assembly including a package overlying a die directly attached to the mainboardINTEL CORP·Filed 2019·Granted Feb 4, 2020·0 cites·15 claims
- 1749US9842832B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2016·Granted Dec 12, 2017·0 cites·20 claims
- 1849US2018263117A1Flexible electronic assembly methodINTEL CORP·Filed 2017·Application pending·0 cites
- 1946US2016043056A1Die assembly on thin dielectric sheetINTEL CORP·Filed 2015·Application pending·0 cites
- 2046US2009321925A1Injection molded metal ic package stiffener and package-to-package interconnect frameGEALER CHARLES A·Filed 2008·Application pending·0 cites
- 2143US6043560AThermal interface thickness control for a microprocessorINTEL CORP·Filed 1997·Granted Mar 28, 2000·11 cites·11 claims
- 2243US2017012029A1Tsv-connected backside decouplingINTEL CORP·Filed 2014·Application pending·0 cites
- 2337US2005121757A1Integrated circuit package overlayFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →