Inventor · disambiguated record
Cheng-Tai Hsiao
Also filed as: HSIAO CHENG · HSIAO CHENG-TAI
20 granted patents·6 pending applications·346 citations·filing 2006–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21TAIWAN SEMICONDUCTOR MFG2HSIAO CHENG1LIN CHUNG-KAI1LO JIA-LIN1
Top patents by PatentIndex Score
26 records- 0199US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 0298US10163651B1Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·32 cites·20 claims
- 0397US10529913B1Techniques for MRAM MTJ top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·15 cites·20 claims
- 0497US9425155B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·28 cites·20 claims
- 0596US10790189B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·9 cites·20 claims
- 0695US11152426B2Memory device using an etch stop dielectric layer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·4 cites·20 claims
- 0792US11183627B2MRAM MTJ top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0886US10090196B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·3 cites·20 claims
- 0986US2025255193A1Techniques for conductive structure connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1085US11183394B2Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·1 cites·20 claims
- 1184US12290003B2Conductive structure connection with interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 1282US11121315B2Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·1 cites·20 claims
- 1379US12185640B2MRAM MTJ with directly coupled top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·20 claims
- 1479US2022310449A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1578US2022208607A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1677US10128209B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·2 cites·20 claims
- 1774US11367623B2Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 1874US2021151353A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 1973US2021013098A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 2071US8275584B2Unified model for process variations in integrated circuitsLIN CHUNG-KAI·Filed 2006·Granted Sep 25, 2012·9 cites·25 claims
- 2170US8370774B2Constructing mapping between model parameters and electrical parametersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 5, 2013·4 cites·20 claims
- 2269US11594679B2Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying heightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 2365US9141735B2Circuit device reliability simulation systemLO JIA-LIN·Filed 2010·Granted Sep 22, 2015·4 cites·14 claims
- 2464US10727077B2Structure and method to expose memory cells with different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 2542US10181441B2Through via structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 15, 2019·0 cites·20 claims
- 2639US2012278050A1Accelerated Generation of Circuit Parameter Distribution Using Monte Carlo SimulationHSIAO CHENG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →