Inventor · disambiguated record
Chang-Sheng Hsu
Also filed as: HSU CHANG-SHENG
20 granted patents·2 pending applications·39 citations·filing 2010–2024
92Inventor score
Top patents by PatentIndex Score
22 records- 0187US10640368B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 5, 2020·5 cites·13 claims
- 0283US10737932B2Micro-electro-mechanical system structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 11, 2020·2 cites·18 claims
- 0383US8536709B1Wafer with eutectic bonding carrier and method of manufacturing the sameHSU CHANG-SHENG·Filed 2012·Granted Sep 17, 2013·8 cites·7 claims
- 0482US9668064B2Microelectromechanical system microphoneUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 30, 2017·3 cites·15 claims
- 0581US9961450B2Piezoresistive microphone and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 1, 2018·3 cites·19 claims
- 0681US8716109B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted May 6, 2014·4 cites·14 claims
- 0776US9107017B1Etching method for manufacturing MEMS deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 11, 2015·4 cites·12 claims
- 0871US8432032B2Chip package and fabrication method thereofLIN CHIA-SHENG·Filed 2010·Granted Apr 30, 2013·3 cites·24 claims
- 0967US11345590B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 31, 2022·0 cites·9 claims
- 1066US8981501B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 17, 2015·2 cites·16 claims
- 1166US8776363B2Method for supporting semiconductor wafer and wafer supporting assemblyHSU CHANG-SHENG·Filed 2012·Granted Jul 15, 2014·3 cites·11 claims
- 1265US10870576B2Semiconductor sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 22, 2020·0 cites·10 claims
- 1363US10115582B2Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 30, 2018·1 cites·6 claims
- 1461US2025313455A1Microelectromechanical systems device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1560US8754504B2Thinned wafer and fabricating method thereofHSU CHANG-SHENG·Filed 2012·Granted Jun 17, 2014·1 cites·13 claims
- 1656US10793426B2Microelectromechanical system structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·0 cites·11 claims
- 1754US10475640B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·4 claims
- 1854US10087072B2Microelectromechanical system structure including thermal stability layer whose material has higher growth temperature, and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 2, 2018·0 cites·8 claims
- 1948US10408780B2Structure of gas sensorUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 10, 2019·0 cites·10 claims
- 2046US9905711B2Avalanche photo detector device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·0 cites·19 claims
- 2144US8564123B2Chip package and fabrication method thereofNI CHING-YU·Filed 2011·Granted Oct 22, 2013·0 cites·15 claims
- 2232US2016229692A1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →