Inventor · disambiguated record
Chang-Sup Lee
Also filed as: LEE CHANG-SUP
24 granted patents·12 pending applications·100 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
36 records- 0197US10032791B2Three-dimensional semiconductor memory deviceLEE CHANG SUP·Filed 2017·Granted Jul 24, 2018·13 cites·20 claims
- 0295US9991271B2Integrated circuit device including vertical memory device and method of manufacturing the sameKANG SHIN HWAN·Filed 2016·Granted Jun 5, 2018·26 cites·19 claims
- 0394US10211154B2Three-dimensional semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·9 cites·15 claims
- 0489US11107765B2Three-dimensional semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 31, 2021·2 cites·16 claims
- 0588US11910614B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·1 cites·20 claims
- 0688US2025096135A1Three-dimensional semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0787US10886289B2Integrated circuit device including vertical memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 5, 2021·3 cites·12 claims
- 0886US2025287595A1Three-dimensional semiconductor memory device with increased process marginSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0985US12183677B2Three-dimensional semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 1085US8925495B1Multifunction pet waste scooperLEE CHANG SUP·Filed 2012·Granted Jan 6, 2015·11 cites·11 claims
- 1181US10644023B2Three-dimensional semiconductor memory device including stacked electrodes having pad portionsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·2 cites·19 claims
- 1280USRE50547EIntegrated circuit device including vertical memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·32 claims
- 1380US11296104B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·1 cites·15 claims
- 1479US10629609B2Three dimensional semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 21, 2020·2 cites·20 claims
- 1578US12317492B2Three-dimensional semiconductor memory device with increased process marginSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1678USRE50225EIntegrated circuit device including vertical memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 1776US11854975B2Three-dimensional semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1875US10297543B2Vertical semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 21, 2019·2 cites·20 claims
- 1974USD701054SChair with double contoured bottomLEE CHANG SUP·Filed 2013·Granted Mar 18, 2014·20 cites·1 claims
- 2074US7923661B2Talking ironLEE CHANG SUP·Filed 2007·Granted Apr 12, 2011·4 cites·11 claims
- 2171US11374019B2Three-dimensional semiconductor memory device including an electrode connecting portionSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·17 claims
- 2271US10658374B2Vertical semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 2363US11309326B2Vertical semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 2463US2025351359A1Semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2561US2019148295A1Three-dimensional semiconductor deviceLEE SUNG HUN·Filed 2019·Application pending·0 cites
- 2661US2025357359A1Semiconductor memory device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2753US2013323433A1Plating method using laser etching processHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 2845US2013299356A1Plating method using intaglio processingHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 2943US2008088473A1Rfid system and method for controlling distance rangesKPC INC·Filed 2007·Application pending·0 cites
- 3042US2008231440A1Electronic seal device and method of sensing opening using the sameKPC INC·Filed 2007·Application pending·0 cites
- 3140US2025074565A1Method of controlling rotational speed of propeller of ship to reduce cavitationMOTH CO LTD·Filed 2023·Application pending·0 cites
- 3239US2011254077A1Semiconductor device and method of fabricating the sameLEE CHANG-SUP·Filed 2011·Application pending·0 cites
- 3337US2011068916A1Life saving system with rfid tag having ip communication functionUNIV DONG A RES FOUNDATION·Filed 2010·Application pending·0 cites
- 3432USD659423SChair with contoured bottomLEE CHANG SUP·Filed 2011·Granted May 15, 2012·1 cites·1 claims
- 3532USD658905SChair with contoured bottomLEE CHANG SUP·Filed 2011·Granted May 8, 2012·1 cites·1 claims
- 3631USD652648SChair with double contoured bottomLEE CHANG SUP·Filed 2011·Granted Jan 24, 2012·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →