Inventor · disambiguated record
Chung-Sun Lee
Also filed as: LEE CHUNG-SUN
19 granted patents·19 pending applications·322 citations·filing 2004–2023
95Inventor score
Top patents by PatentIndex Score
38 records- 0197US8604615B2Semiconductor device including a stack of semiconductor chips, underfill material and molding materialLEE CHUNG-SUN·Filed 2011·Granted Dec 10, 2013·75 cites·42 claims
- 0296US9343432B2Semiconductor chip stack having improved encapsulationSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·23 cites·20 claims
- 0395US7948555B2Camera module and electronic apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 24, 2011·32 cites·17 claims
- 0494US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0592US7554201B2Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 30, 2009·41 cites·12 claims
- 0689US11315802B2Method for manufacturing semiconductor package having redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 26, 2022·6 cites·18 claims
- 0789US7786581B2Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 31, 2010·16 cites·10 claims
- 0888US7619315B2Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 17, 2009·14 cites·11 claims
- 0986US7299547B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·11 cites·15 claims
- 1085US7893514B2Image sensor package, method of manufacturing the same, and image sensor module including the image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 22, 2011·14 cites·13 claims
- 1184US7078331B2Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·32 cites·11 claims
- 1271US7190073B2Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 13, 2007·4 cites·14 claims
- 1365US8114701B2Camera modules and methods of fabricating the sameKWON WOON-SEONG·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 1465US7087987B2Tape circuit substrate and semiconductor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 8, 2006·11 cites·26 claims
- 1563US7569423B2Wafer-level-chip-scale package and method of fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 4, 2009·3 cites·7 claims
- 1660US7895742B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 1, 2011·1 cites·13 claims
- 1759US2024072000A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1857US7884392B2Image sensor having through viaLEE HYUEK-JAE·Filed 2009·Granted Feb 8, 2011·2 cites·20 claims
- 1956US2024178188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2052US2010019338A1Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2149US8250750B2Method for manufacturing tape wiring boardCHOI KYOUNG-SEI·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 2249US2007126110A1Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2349US2008012084A1Image sensor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2447US2009256931A1Camera module, method of manufacturing the same, and electronic system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2547US2006202334A1Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2645US10957833B2Light emitting diode display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2745US2008284041A1Semiconductor package with through silicon via and related method of fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2845US2010320500A1Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2945US2008083983A1Bump electrode including plating layers and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3044US2014252626A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3144US2008054456A1Semiconductor package including silver bump and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3244US2006091504A1Film circuit substrate having Sn-In alloy layerKANG UN-BYOUNG·Filed 2005·Application pending·0 cites
- 3344US2008055438A1Image sensor package, related method of manufacture and image sensor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3443US2006071303A1Film substrate of a semiconductor package and a manufacturing methodLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 3539US2005205524A1Method of manufacturing tape wiring substrateLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
- 3638US2007018324A1Wafer-level-chip-scale package and method of fabricationKWON YONG-HWAN·Filed 2006·Application pending·0 cites
- 3738US2004251546A1Package and method for bonding between gold lead and gold bumpFiled 2004·Application pending·0 cites
- 3837US2007007664A1Semiconductor package with molded back side and method of fabricating the sameLEE CHUNG-SUN·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chung-Sun Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →