Inventor · disambiguated record
Christopher S. Ngai
Also filed as: NGAI CHRISTOPHER · NGAI CHRISTOPHER S · NGAI CHRISTOPHER SIU WING
36 granted patents·9 pending applications·1,935 citations·filing 1994–2023
97Inventor score
Top patents by PatentIndex Score
45 records- 0198US6573030B1Method for depositing an amorphous carbon layerAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·1.3k cites·129 claims
- 0296US6780753B2Airgap for semiconductor devicesAPPLIED MATERIALS INC·Filed 2002·Granted Aug 24, 2004·126 cites·18 claims
- 0395US7335462B2Method of depositing an amorphous carbon layerAPPLIED MATERIALS INC·Filed 2007·Granted Feb 26, 2008·24 cites·20 claims
- 0495US6841341B2Method of depositing an amorphous carbon layerAPPLIED MATERIALS INC·Filed 2002·Granted Jan 11, 2005·78 cites·19 claims
- 0593US7223526B2Method of depositing an amorphous carbon layerAPPLIED MATERIALS INC·Filed 2004·Granted May 29, 2007·50 cites·20 claims
- 0693US6355571B1Method and apparatus for reducing copper oxidation and contamination in a semiconductor deviceAPPLIED MATERIALS INC·Filed 1999·Granted Mar 12, 2002·98 cites·14 claims
- 0791US6656840B2Method for forming silicon containing layers on a substrateAPPLIED MATERIALS INC·Filed 2002·Granted Dec 2, 2003·54 cites·18 claims
- 0889US11429026B2Lithography process window enhancement for photoresist patterningAPPLIED MATERIALS INC·Filed 2020·Granted Aug 30, 2022·2 cites·20 claims
- 0989US9502262B2Nanocrystalline diamond carbon film for 3D NAND hardmask applicationAPPLIED MATERIALS INC·Filed 2015·Granted Nov 22, 2016·5 cites·18 claims
- 1088US6946401B2Plasma treatment for copper oxide reductionAPPLIED MATERIALS INC·Filed 2003·Granted Sep 20, 2005·28 cites·13 claims
- 1186US5441568AExhaust baffle for uniform gas flow patternAPPLIED MATERIALS INC·Filed 1994·Granted Aug 15, 1995·95 cites·19 claims
- 1285US9728406B2Multi materials and selective removal enabled reverse tone processAPPLIED MATERIALS INC·Filed 2015·Granted Aug 8, 2017·4 cites·20 claims
- 1385US7935464B2System and method for self-aligned dual patterningAPPLIED MATERIALS INC·Filed 2008·Granted May 3, 2011·8 cites·12 claims
- 1481US11437284B2Contact over active gate structureAPPLIED MATERIALS INC·Filed 2019·Granted Sep 6, 2022·2 cites·17 claims
- 1580US9865464B2Nanocrystalline diamond carbon film for 3D NAND hardmask applicationAPPLIED MATERIALS INC·Filed 2016·Granted Jan 9, 2018·2 cites·20 claims
- 1676US10930555B2Contact over active gate structureAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 1776US9337051B2Method for critical dimension reduction using conformal carbon filmsAPPLIED MATERIALS INC·Filed 2015·Granted May 10, 2016·2 cites·19 claims
- 1875US8323451B2System and method for self-aligned dual patterningNGAI CHRISTOPHER SIU WING·Filed 2011·Granted Dec 4, 2012·4 cites·14 claims
- 1974US12201030B2Spin-orbit torque MRAM structure and manufacture thereofAPPLIED MATERIALS INC·Filed 2023·Granted Jan 14, 2025·0 cites·3 claims
- 2073US11880137B2Film structure for electric field guided photoresist patterning processAPPLIED MATERIALS INC·Filed 2023·Granted Jan 23, 2024·0 cites·20 claims
- 2172US9815091B2Roll to roll wafer backside particle and contamination removalAPPLIED MATERIALS INC·Filed 2014·Granted Nov 14, 2017·2 cites·20 claims
- 2270US11914299B2Lithography process window enhancement for photoresist patterningAPPLIED MATERIALS INC·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 2370US6700202B2Semiconductor device having reduced oxidation interfaceAPPLIED MATERIALS INC·Filed 2001·Granted Mar 2, 2004·8 cites·5 claims
- 2469US12198985B2Contact over active gate structureAPPLIED MATERIALS INC·Filed 2022·Granted Jan 14, 2025·0 cites·11 claims
- 2569US10930556B2Contact over active gate structureAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·1 cites·23 claims
- 2668US8501395B2Line edge roughness reduction and double patterningDAI HUIXIONG·Filed 2008·Granted Aug 6, 2013·5 cites·20 claims
- 2768US8183150B2Semiconductor device having silicon carbide and conductive pathway interfaceHUANG JUDY H·Filed 2008·Granted May 22, 2012·2 cites·16 claims
- 2863US6797646B2Method of nitrogen doping of fluorinated silicate glass (FSG) while removing the photoresist layerAPPLIED MATERIALS INC·Filed 2001·Granted Sep 28, 2004·5 cites·10 claims
- 2962US11723283B2Spin-orbit torque MRAM structure and manufacture thereofAPPLIED MATERIALS INC·Filed 2020·Granted Aug 8, 2023·0 cites·10 claims
- 3062US7105442B2Ashable layers for reducing critical dimensions of integrated circuit featuresAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·9 cites·8 claims
- 3159US11650506B2Film structure for electric field guided photoresist patterning processAPPLIED MATERIALS INC·Filed 2019·Granted May 16, 2023·0 cites·15 claims
- 3259US8293460B2Double exposure patterning with carbonaceous hardmaskCHEN HUI W·Filed 2008·Granted Oct 23, 2012·2 cites·8 claims
- 3357US11313034B2Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor depositionAPPLIED MATERIALS INC·Filed 2017·Granted Apr 26, 2022·0 cites·11 claims
- 3455US11609505B2Apparatus and methods for verification and re-use of process fluidsAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·21 claims
- 3553US2019212656A1PVD Films For EUV LithographyAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3652US2005263900A1Semiconductor device having silicon carbide and conductive pathway interfaceAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3751US10957590B2Method for forming a layerAPPLIED MATERIALS INC·Filed 2019·Granted Mar 23, 2021·0 cites·12 claims
- 3851US2018135183A1Surface Treatment For EUV LithographyAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3950US2021041785A1Process control of electric field guided photoresist baking processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4049US2021088896A1Lithography simulation and optical proximity correctionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4144US2022091513A1Film structure for electric field assisted bake processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4243US10927450B2Methods and apparatus for patterning substrates using asymmetric physical vapor depositionAPPLIED MATERIALS INC·Filed 2018·Granted Feb 23, 2021·0 cites·18 claims
- 4341US2020135464A1Methods and apparatus for patterning substrates using asymmetric physical vapor depositionAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 4440US2013115778A1Dry Etch ProcessesXUE JUN·Filed 2012·Application pending·0 cites
- 4536US2012085733A1Self aligned triple patterningMEBARKI BENCHERKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →