Inventor · disambiguated record
Chee Kian Ong
Also filed as: ONG CHEE KIAN
8 granted patents·3 pending applications·27 citations·filing 2007–2016
80Inventor score
Top patents by PatentIndex Score
11 records- 0191US8207608B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2007·Granted Jun 26, 2012·25 cites·26 claims
- 0266US9362206B2Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 7, 2016·1 cites·25 claims
- 0364US8846519B2Interconnections for fine pitch semiconductor devices and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2012·Granted Sep 30, 2014·1 cites·17 claims
- 0451US2016268225A1Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 0550US8796844B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Aug 5, 2014·0 cites·30 claims
- 0649US9396982B2Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereofCHEW HWEE-SENG JIMMY·Filed 2008·Granted Jul 19, 2016·0 cites·10 claims
- 0749US2016329306A1Semiconductor package and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 0847US9120169B2Method for device packagingCHEW HWEE SENG·Filed 2009·Granted Sep 1, 2015·0 cites·17 claims
- 0946US8766438B2Package structureCHEW HWEE-SENG JIMMY·Filed 2009·Granted Jul 1, 2014·0 cites·22 claims
- 1045US9287157B2Semiconductor element for package miniaturizationCHEW HWEE-SENG JIMMY·Filed 2010·Granted Mar 15, 2016·0 cites·17 claims
- 1139US2008248610A1Thermal bonding process for chip packagingADVANPACK SOLUTIONS PTE LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →