Inventor · disambiguated record
Chi-Chih Shen
Also filed as: SHEN CHI-CHIH
37 granted patents·13 pending applications·447 citations·filing 2000–2025
96Inventor score
Files withPIXART IMAGING INC25SHEN CHI-CHIH11ADVANCED SEMICONDUCTOR ENG8CHEN KUANG-HSIUNG2CHANG YI-CHANG1
Top patents by PatentIndex Score
50 records- 0198US8012797B2Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometriesADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 6, 2011·146 cites·20 claims
- 0297US8158888B2Circuit substrate and method of fabricating the same and chip package structureSHEN CHI-CHIH·Filed 2009·Granted Apr 17, 2012·81 cites·27 claims
- 0395US7791211B2Flip chip package structure and carrier thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 7, 2010·75 cites·8 claims
- 0493US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0591US11495697B2Optical component packaging structurePIXART IMAGING INC·Filed 2020·Granted Nov 8, 2022·2 cites·3 claims
- 0690US8446000B2Package structure and package processSHEN CHI-CHIH·Filed 2010·Granted May 21, 2013·19 cites·23 claims
- 0788US8258007B2Package processSHEN CHI-CHIH·Filed 2010·Granted Sep 4, 2012·10 cites·7 claims
- 0885US6383846B1Method and apparatus for molding a flip chip semiconductor deviceFiled 2000·Granted May 7, 2002·42 cites·4 claims
- 0982US2025259967A1Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1082US2025067667A1Smoke detector reducing false alarm ratePIXART IMAGING INC·Filed 2024·Application pending·0 cites
- 1181US9698120B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Jul 4, 2017·4 cites·17 claims
- 1279US12040416B2Far-infrared sensor packaging structurePIXART IMAGING INC·Filed 2022·Granted Jul 16, 2024·0 cites·3 claims
- 1379US10896983B2Optical component packaging structurePIXART IMAGING INC·Filed 2019·Granted Jan 19, 2021·1 cites·7 claims
- 1478US9741875B2Sensor chip package structure and manufacturing method thereofPIXART IMAGING INC·Filed 2016·Granted Aug 22, 2017·3 cites·11 claims
- 1577US10672937B2Optical sensor module and sensor chip thereofPIXART IMAGING INC·Filed 2017·Granted Jun 2, 2020·2 cites·19 claims
- 1677US10439077B2Optical component packaging structurePIXART IMAGING INC·Filed 2018·Granted Oct 8, 2019·1 cites·7 claims
- 1776US12188865B2Optical machine of smoke detectorPIXART IMAGING INC·Filed 2022·Granted Jan 7, 2025·0 cites·12 claims
- 1875US12266632B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 1, 2025·0 cites·7 claims
- 1965US8531593B2Display panel with image capture module and assembling method of the sameSHEN CHI CHIH·Filed 2010·Granted Sep 10, 2013·1 cites·5 claims
- 2065US8110928B2Stacked-type chip package structure and method of fabricating the sameSHEN CHI-CHIH·Filed 2008·Granted Feb 7, 2012·3 cites·10 claims
- 2164US10340299B2Optical sensor package module and manufacturing method thereofPIXART IMAGING INC·Filed 2017·Granted Jul 2, 2019·1 cites·19 claims
- 2264US8618645B2Package process and package structureSHEN CHI-CHIH·Filed 2010·Granted Dec 31, 2013·1 cites·10 claims
- 2363US10964839B2Manufacturing method of sensor chip package structurePIXART IMAGING INC·Filed 2020·Granted Mar 30, 2021·0 cites·12 claims
- 2462US11990557B2Miniaturized optical sensor package and manufacturing method thereofPIXART IMAGING INC·Filed 2020·Granted May 21, 2024·0 cites·8 claims
- 2560US8105877B2Method of fabricating a stacked type chip package structureSHEN CHI-CHIH·Filed 2008·Granted Jan 31, 2012·2 cites·14 claims
- 2659US10002975B2Optical component packaging structurePIXART IMAGING INC·Filed 2017·Granted Jun 19, 2018·0 cites·11 claims
- 2758US2024405042A1Optical detection module and related manufacturing methodPIXART IMAGING INC·Filed 2023·Application pending·0 cites
- 2857US11222866B2Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 11, 2022·0 cites·20 claims
- 2956US11156796B2Optical sensor package modulePIXART IMAGING INC·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 3055US10529759B2Optical sensor package module and manufacturing method thereofPIXART IMAGING INC·Filed 2019·Granted Jan 7, 2020·0 cites·17 claims
- 3155US2013044380A1Lens module and method for manufacturing the samePIXART IMAGING INC·Filed 2011·Application pending·0 cites
- 3253US9142529B2Chip package with improved heat dissipation and manufacturing method thereofCHANG YI-CHANG·Filed 2014·Granted Sep 22, 2015·1 cites·9 claims
- 3352US2025267349A1Cubic camera and manufacturing method thereofPIXART IMAGING INC·Filed 2024·Application pending·0 cites
- 3450US2010327465A1Package process and package structureADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 3547US10378952B2Optical detecting device capable of preventing environmental pollutionPIXART IMAGING INC·Filed 2016·Granted Aug 13, 2019·0 cites·7 claims
- 3647US2010219524A1Chip scale package and method of fabricating the sameSHEN CHI-CHIH·Filed 2009·Application pending·0 cites
- 3747US2012205800A1Packaging structureSHEN CHI-CHIH·Filed 2012·Application pending·0 cites
- 3845US10274365B2Optical module package structure and method thereofPIXART IMAGING INC·Filed 2017·Granted Apr 30, 2019·0 cites·14 claims
- 3945US2009127706A1Chip structure, substrate structure, chip package structure and process thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 4044US9778101B2Optical detecting module with preferred light utilization efficiencyPIXART IMAGING INC·Filed 2015·Granted Oct 3, 2017·0 cites·11 claims
- 4144US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 4243US10527488B2Optical detecting device having gas emission and gas pressure reduction functionPIXART IMAGING INC·Filed 2016·Granted Jan 7, 2020·0 cites·9 claims
- 4343US9976898B2Optical sensing module with multi-directional optical sensing functionPIXART IMAGING INC·Filed 2016·Granted May 22, 2018·0 cites·21 claims
- 4443US2014014824A1Non-lens package structure for an optical devicePIXART IMAGING INC·Filed 2013·Application pending·0 cites
- 4541US9823115B2Packaged optical device having a specular reflection configurationPIXART IMAGING INC·Filed 2016·Granted Nov 21, 2017·0 cites·7 claims
- 4641US9627286B1Package structurePIXART IMAGING INC·Filed 2016·Granted Apr 18, 2017·0 cites·15 claims
- 4737US8841593B2Sensing device and image sensor module thereofWANG WEI CHUNG·Filed 2011·Granted Sep 23, 2014·0 cites·19 claims
- 4837US8390129B2Semiconductor device with a plurality of mark through substrate viasSHEN CHI-CHIH·Filed 2010·Granted Mar 5, 2013·0 cites·18 claims
- 4934US2011300669A1Method for Making Die AssembliesSHEN CHI-CHIH·Filed 2010·Application pending·0 cites
- 5029US2003129272A1Mold for an integrated circuit packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →