Inventor · disambiguated record
Cha Gyu Song
Also filed as: SONG CHA GYU
5 granted patents·2 pending applications·12 citations·filing 2014–2021
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0180US11031356B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jun 8, 2021·2 cites·5 claims
- 0280US10297552B2Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnectsAMKOR TECHNOLOGY INC·Filed 2016·Granted May 21, 2019·3 cites·20 claims
- 0380US9917063B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Mar 13, 2018·4 cites·16 claims
- 0475US9502392B2Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnectsAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 22, 2016·3 cites·19 claims
- 0567US2021296263A1Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
- 0656US10504857B2Semiconductor package structure for improving die warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 10, 2019·0 cites·22 claims
- 0754US2019311991A1Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnectsAMKOR TECHNOLOGY INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →