Inventor · disambiguated record
Chunhai Wang
Also filed as: WANG CHUNHAI
9 granted patents·3 pending applications·57 citations·filing 2003–2021
83Inventor score
Top patents by PatentIndex Score
12 records- 0187US10324045B2Surface defect inspection with large particle monitoring and laser power controlKLA TENCOR CORP·Filed 2016·Granted Jun 18, 2019·4 cites·20 claims
- 0284US11085628B1Modular heat dissipation structure and LED lighting deviceMESTER LED LTD·Filed 2020·Granted Aug 10, 2021·3 cites·16 claims
- 0383US7448798B1Scanning thermal probe microscopeVEECO INSTR INC·Filed 2003·Granted Nov 11, 2008·41 cites·84 claims
- 0470US7958776B2Atomic force gradient microscope and method of using this microscopeWANG CHUNHAI·Filed 2007·Granted Jun 14, 2011·6 cites·20 claims
- 0566US9163928B2Reducing registration error of front and back wafer surfaces utilizing a see-through calibration waferKLA TENCOR CORP·Filed 2013·Granted Oct 20, 2015·3 cites·18 claims
- 0652US11733172B2Apparatus and method for rotating an optical objectiveKLA CORP·Filed 2021·Granted Aug 22, 2023·0 cites·38 claims
- 0750US9903708B2Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrateKLA TENCOR CORP·Filed 2016·Granted Feb 27, 2018·0 cites·20 claims
- 0846US9279663B2Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrateWANG CHUNHAI·Filed 2012·Granted Mar 8, 2016·0 cites·20 claims
- 0943US2020363051A1Emergency Lighting Device with Thermally Separated Lighting Module and Emergency ModuleMESTER LED LTD·Filed 2019·Application pending·0 cites
- 1035US2015176973A1A dual interferometer system with a short reference flat distance for wafer shape and thickness variation measurementTANG SHOUHONG·Filed 2011·Application pending·0 cites
- 1133US2015192404A1Reducing registration error of front and back wafer surfaces utilizing a see-through calibration waferKLA TENCOR CORP·Filed 2015·Application pending·0 cites
- 1232US10532915B2Automatic continuous operation robot for laying large-diameter pipelines and operating method thereforTIANJIN AMJOY TECH CO LTD·Filed 2016·Granted Jan 14, 2020·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →