Inventor · disambiguated record
Christian Witt
Also filed as: WITT CHRISTIAN · WITT CHRISTIAN A
19 granted patents·8 pending applications·104 citations·filing 2004–2024
93Inventor score
Top patents by PatentIndex Score
27 records- 0197US11145349B1Physically unclonable function architecture including memory cells with parallel-connected access transistors and common write wordlinesGLOBALFOUNDRIES US INC·Filed 2020·Granted Oct 12, 2021·10 cites·20 claims
- 0293US7410899B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Aug 12, 2008·21 cites·22 claims
- 0389US7332193B2Cobalt and nickel electroless plating in microelectronic devicesENTHONE·Filed 2005·Granted Feb 19, 2008·16 cites·17 claims
- 0485US10224284B1Soluble self aligned barrier layer for interconnect structureGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 5, 2019·4 cites·17 claims
- 0583US7611988B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·7 cites·4 claims
- 0683US7393781B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2007·Granted Jul 1, 2008·10 cites·24 claims
- 0782US10580696B1Interconnects formed by a metal displacement reactionGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 0882US8932934B2Methods of self-forming barrier integration with pore stuffed ULK materialGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 13, 2015·6 cites·13 claims
- 0982US7611987B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 3, 2009·6 cites·17 claims
- 1077US7615491B2Defectivity and process control of electroless deposition in microelectronics applicationsENTHONE·Filed 2005·Granted Nov 10, 2009·4 cites·11 claims
- 1176US9054052B2Methods for integration of pore stuffing materialGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 9, 2015·3 cites·17 claims
- 1265US10109524B2Recessing of liner and conductor for via formationGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 23, 2018·1 cites·19 claims
- 1364US9768058B2Methods of forming air gaps in metallization layers on integrated circuit productsGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 19, 2017·1 cites·19 claims
- 1464US9236299B2Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit deviceGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 12, 2016·1 cites·25 claims
- 1562US7268074B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2004·Granted Sep 11, 2007·9 cites·17 claims
- 1661US12199177B1High-electron-mobility transistors with inactive gate blocksGLOBALFOUNDRIES US INC·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 1759US8580665B2MOSFET integrated circuit having doped conductive interconnects and methods for its manufactureWITT CHRISTIAN·Filed 2011·Granted Nov 12, 2013·2 cites·15 claims
- 1851US7696093B2Methods for forming copper interconnects for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2008·Granted Apr 13, 2010·0 cites·27 claims
- 1949US2006280860A1Cobalt electroless plating in microelectronic devicesENTHONE·Filed 2005·Application pending·0 cites
- 2047US2006188659A1Cobalt self-initiated electroless via fill for stacked memory cellsENTHONE·Filed 2005·Application pending·0 cites
- 2145US2016104670A1Interlayer ballistic conductor signal linesGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 2245US2016104672A1Low capacitance ballistic conductor signal linesGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 2342US2014145332A1Methods of forming graphene liners and/or cap layers on copper-based conductive structuresGLOBALFOUNDRIES INC·Filed 2012·Application pending·0 cites
- 2442US2014353805A1Methods of semiconductor contaminant removal using supercritical fluidGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2541US2007178697A1Copper electrodeposition in microelectronicsENTHONE·Filed 2006·Application pending·0 cites
- 2636US10886215B2Interconnect structure and related methodsIMEC VZW·Filed 2019·Granted Jan 5, 2021·0 cites·18 claims
- 2736US2011281431A1Method of patterning thin metal filmsWITT CHRISTIAN A·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →