Inventor · disambiguated record
Chiaki Yasumuro
Also filed as: YASUMURO CHIAKI
7 granted patents·6 pending applications·18 citations·filing 2009–2014
78Inventor score
Top patents by PatentIndex Score
13 records- 0187US8399353B2Methods of forming copper wiring and copper film, and film forming systemISHIZAKA TADAHIRO·Filed 2011·Granted Mar 19, 2013·9 cites·13 claims
- 0285US10309005B2Deposition device and deposition methodTOKYO ELECTRON LTD·Filed 2014·Granted Jun 4, 2019·3 cites·19 claims
- 0373US8859422B2Method of forming copper wiring and method and system for forming copper filmISHIZAKA TADAHIRO·Filed 2012·Granted Oct 14, 2014·3 cites·26 claims
- 0471US8992686B2Mounting table structure, film forming apparatus and raw material recovery methodGOMI ATSUSHI·Filed 2011·Granted Mar 31, 2015·3 cites·41 claims
- 0552US2014287163A1Method of forming copper wiring and method and system for forming copper filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 0646US8408025B2Raw material recovery method and trapping mechanism for recovering raw materialGOMI ATSUSHI·Filed 2009·Granted Apr 2, 2013·0 cites·15 claims
- 0745US9406557B2Copper wiring forming method with Ru liner and Cu alloy fillTOKYO ELECTRON LTD·Filed 2014·Granted Aug 2, 2016·0 cites·8 claims
- 0842US9253862B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Feb 2, 2016·0 cites·10 claims
- 0940US2013237053A1Film forming method and film forming apparatusISHIZAKA TADAHIRO·Filed 2011·Application pending·0 cites
- 1040US2014060572A1Plasma processing apparatus and cleaning method for removing metal oxide filmTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1139US2013252417A1Thin film forming methodISHIZAKA TADAHIRO·Filed 2012·Application pending·0 cites
- 1236US2012064717A1Method for forming cvd-ru film and method for manufacturing semiconductor devicesKATO TAKARA·Filed 2011·Application pending·0 cites
- 1334US2012222782A1METHOD FOR FORMING Cu WIRINGGOMI ATSUSHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →