Inventor · disambiguated record
David C. H. Cheng
Also filed as: CHENG DAVID C · CHENG DAVID C H · CHENG DAVID CHEEKIT
38 granted patents·10 pending applications·1,452 citations·filing 1989–2012
98Inventor score
Files withUNIMICRON TECHNOLOGY CORP13HUGHES ELECTRONICS CORP12IBM5INTERVOICE LP4UNIMICRON TAIWAN CORP3
Top patents by PatentIndex Score
48 records- 0197US6353999B1Method of making mechanical-laser structureUNIMICRON TAIWAN CORP·Filed 1999·Granted Mar 12, 2002·144 cites·8 claims
- 0296US6506632B1Method of forming IC package having downward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·164 cites·22 claims
- 0391US6506633B1Method of fabricating a multi-chip module packageUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Jan 14, 2003·81 cites·26 claims
- 0489US6709897B2Method of forming IC package having upward-facing chip cavityUNIMICRON TECHNOLOGY CORP·Filed 2002·Granted Mar 23, 2004·64 cites·30 claims
- 0588US6766987B2Satellite system and method of deploying sameHUGHES ELECTRONICS CORP·Filed 2002·Granted Jul 27, 2004·25 cites·9 claims
- 0686US6336612B1Satellite system and method of deploying sameHUGHES ELECTRONICS CORP·Filed 2001·Granted Jan 8, 2002·22 cites·6 claims
- 0786US6229477B1Method and system for determining a position of a communication satellite utilizing two-way rangingHUGHES ELECTRONICS CORP·Filed 1998·Granted May 8, 2001·127 cites·22 claims
- 0886US6201300B1Printed circuit board with thermal conductive structureWORLD WISER ELECTRONICS INC·Filed 1998·Granted Mar 13, 2001·113 cites·31 claims
- 0984US6785553B2Position location of multiple transponding platforms and users using two-way ranging as a calibration reference for GPSDIRECTV GROUP INC·Filed 2001·Granted Aug 31, 2004·56 cites·14 claims
- 1084US6175497B1Thermal vias-provided cavity-down IC package structureWORLD WISER ELECTRONICS INC·Filed 1999·Granted Jan 16, 2001·114 cites·9 claims
- 1184US5026470ASputtering apparatusIBM·Filed 1989·Granted Jun 25, 1991·41 cites·6 claims
- 1282US6460808B2Satellite system and method of deploying sameHUGHES ELECTRONICS CORP·Filed 2001·Granted Oct 8, 2002·16 cites·12 claims
- 1379US6327872B1Method and apparatus for producing a pressurized high purity liquid carbon dioxide streamBOC GROUP INC·Filed 2000·Granted Dec 11, 2001·39 cites·8 claims
- 1479US5740233ASystem and method for statistical diagnosis of the operation of an automated telephone systemINTERVOICE LP·Filed 1995·Granted Apr 14, 1998·76 cites·50 claims
- 1578US7284323B2Process of fabricating conductive columnUNIMICRON TECHNOLOGY CORP·Filed 2004·Granted Oct 23, 2007·20 cites·10 claims
- 1678US6963548B1Coherent synchronization of code division multiple access signalsDIRECTV GROUP INC·Filed 2000·Granted Nov 8, 2005·20 cites·12 claims
- 1777US5822401AStatistical diagnosis in interactive voice response telephone systemINTERVOICE LP·Filed 1997·Granted Oct 13, 1998·67 cites·14 claims
- 1875US6257526B1Satellite system and method of deploying sameHUGHES ELECTRONICS CORP·Filed 1998·Granted Jul 10, 2001·33 cites·24 claims
- 1974US7888174B2Embedded chip package processUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Feb 15, 2011·5 cites·12 claims
- 2074US6638858B2Hole metal-filling methodUNIMICRON TAIWAN CORP·Filed 2001·Granted Oct 28, 2003·21 cites·10 claims
- 2167US5483515AApparatus and method for cancelling cross-talk in signals from optical data storage systemsIBM·Filed 1994·Granted Jan 9, 1996·17 cites·23 claims
- 2266US8288663B2Electrical interconnect structure and process thereof and circuit board structureCHEN TSUNG-YUAN·Filed 2008·Granted Oct 16, 2012·2 cites·15 claims
- 2366US6483672B1Track width control of readback elements with ions implantation in a bounding region of tip portion to selectively deactivate magnetic sensitivity thereofIBM·Filed 1999·Granted Nov 19, 2002·18 cites·3 claims
- 2464US6032355AMethod of forming thermal conductive structure on printed circuit boardWORLD WISER ELECTRONICS INC·Filed 1998·Granted Mar 7, 2000·30 cites·31 claims
- 2563US7663249B2Embedded chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Feb 16, 2010·2 cites·6 claims
- 2662US6313790B2Method and system for determining a position of a transceiver in a communications networkHUGHES ELECTRONICS CORP·Filed 2001·Granted Nov 6, 2001·17 cites·8 claims
- 2762US6246363B1Method and system for incorporating two-way ranging navigation as a calibration reference for GPSHUGHES ELECTRONICS CORP·Filed 1998·Granted Jun 12, 2001·43 cites·15 claims
- 2860US7772703B2Package substrateUNIMICRON TECHNOLOGY CORP·Filed 2006·Granted Aug 10, 2010·1 cites·20 claims
- 2958US9237643B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2012·Granted Jan 12, 2016·0 cites·5 claims
- 3058US6501941B1Method for identifying growth limits of handheld services for mobile satellite communicationsHUGHES ELECTRONICS CORP·Filed 1999·Granted Dec 31, 2002·19 cites·11 claims
- 3157US8365400B2Manufacturing process for a circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Feb 5, 2013·0 cites·13 claims
- 3256US6606307B1Techniques for utilization of bandwidth space assetsHUGHES ELECTRONICS CORP·Filed 1999·Granted Aug 12, 2003·23 cites·34 claims
- 3354US6288858B1Method for improving magnetic recording at high data rates for waveforms having a burst of transitionsIBM·Filed 1999·Granted Sep 11, 2001·12 cites·38 claims
- 3453US5402052AInductive current switching system with resonanceIBM·Filed 1993·Granted Mar 28, 1995·9 cites·6 claims
- 3550US2009273907A1Circuit board and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 3650US2009166059A1Circuit board and process thereofUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 3748US2009144972A1Circuit board and process for fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 3847US2008029890A1Embedded chip package process and circuit board with embedded chipUNIMICRON TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 3946US2012124830A1Process for fabricating circuit boardCHENG DAVID C H·Filed 2012·Application pending·0 cites
- 4046US2004056148A1Satellite system and method of deploying sameHUGHES ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 4145US6210746B1Method of fabricating a solder resist maskUNIMICRON TAIWAN CORP·Filed 1999·Granted Apr 3, 2001·10 cites·25 claims
- 4244US2007203927A1System and method for defining and inserting metadata attributes in filesINTERVOICE LP·Filed 2006·Application pending·0 cites
- 4344US2007203875A1System and method for retrieving files from a file server using file attributesINTERVOICE LP·Filed 2006·Application pending·0 cites
- 4443US6807397B2Method for identifying growth limits of handheld services for mobile satellite communicationsHUGHES ELECTRONICS CORP·Filed 2002·Granted Oct 19, 2004·1 cites·30 claims
- 4540US2001006117A1Mechanical -laser structure on printed circuit board and carrierFiled 2001·Application pending·0 cites
- 4636US2001000156A1Package board structure and manufacturing method thereofFiled 2000·Application pending·0 cites
- 4733US8153472B2Embedded chip package processCHENG DAVID C H·Filed 2010·Granted Apr 10, 2012·0 cites·14 claims
- 4820US6643268B1Method for re-routing signals in a switch networkHUGHES ELECTRONICS CORP·Filed 1999·Granted Nov 4, 2003·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →