Inventor · disambiguated record
Dae Byoung Kang
Also filed as: KANG DAE BYOUNG
15 granted patents·2 pending applications·176 citations·filing 2003–2024
93Inventor score
Files withAMKOR TECHNOLOGY INC9AMKOR TECH SINGAPORE HOLDING PTE LTD5KIM DO-HYUNG1KIM GWANG HO1LEE DONG HEE1
Top patents by PatentIndex Score
17 records- 0195US7982298B1Package in package semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2008·Granted Jul 19, 2011·56 cites·18 claims
- 0294US9859203B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 2, 2018·16 cites·18 claims
- 0393US11961797B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·2 cites·19 claims
- 0493US8890329B2Semiconductor deviceKIM DO HYUNG·Filed 2012·Granted Nov 18, 2014·18 cites·20 claims
- 0591US8441123B1Semiconductor device with metal dam and fabricating methodLEE DONG HEE·Filed 2009·Granted May 14, 2013·30 cites·26 claims
- 0690US10037949B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 31, 2018·11 cites·20 claims
- 0787US11121071B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 14, 2021·2 cites·17 claims
- 0885US12388005B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0985US8089145B1Semiconductor device including increased capacity leadframeKIM GWANG HO·Filed 2008·Granted Jan 3, 2012·20 cites·20 claims
- 1083US10242956B1Semiconductor device with metal dam and fabricating methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 26, 2019·6 cites·21 claims
- 1182US12494414B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 1273US10811341B2Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·1 cites·20 claims
- 1369US11869829B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 9, 2024·0 cites·12 claims
- 1466US6897550B1Fully-molded leadframe stand-off featureAMKOR TECHNOLOGY INC·Filed 2003·Granted May 24, 2005·14 cites·20 claims
- 1559US10586761B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 10, 2020·0 cites·10 claims
- 1653US2017117214A1Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1744US2015303170A1Singulated unit substrate for a semicondcutor deviceAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →