Inventor · disambiguated record
Daniel Richter
Also filed as: RICHTER DANIEL · RICHTER DANIEL GINN
11 granted patents·11 pending applications·16 citations·filing 2005–2025
84Inventor score
Files withWOLFSPEED INC8AMKOR TECHNOLOGY INC4AMKOR TECH SINGAPORE HOLDING PTE LTD3FRAUNHOFER GES FORSCHUNG2ADVANCED MICRO DEVICES INC1
Top patents by PatentIndex Score
22 records- 0191US10304697B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·6 cites·19 claims
- 0277US10832921B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 0375US2025167007A1Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0474US11916033B2Method and system for packing optimization of semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 27, 2024·0 cites·19 claims
- 0572US10734343B2Method and system for packing optimization of semiconductor devicesAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 4, 2020·1 cites·20 claims
- 0671US7491556B2Efficient method of forming and assembling a microelectronic chip including solder bumpsADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 17, 2009·6 cites·8 claims
- 0770US12205827B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 21, 2025·0 cites·20 claims
- 0863US11239192B2Method and system for packing optimization of semiconductor devicesAMKOR TECH SINGAPORE PTE LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0962US8664025B2Substrate dicing technique for separating semiconductor dies with reduced area consumptionRICHTER DANIEL·Filed 2011·Granted Mar 4, 2014·2 cites·14 claims
- 1057US2024243106A1Thermal Enhanced Power Semiconductor PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1155US2025343117A1Semiconductor devices having metal gate runners with asymmetric outer gate runners, unevenly-spaced inner gate runners and/or spine-rib inner gate runners with multiple ribsWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1254US2024421029A1Semiconductor PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1352US2025105196A1Semiconductor Die BondingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1452US2018047692A1Method and System for Packing Optimization of Semiconductor DevicesAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1552US2025125231A1Direct Bonded Semiconductor Die PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1651US2023326897A1Die backside metallization methods and apparatusWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1749US9478489B2Semiconductor dies with reduced area consumptionGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 25, 2016·0 cites·17 claims
- 1848US2024421044A1Die-Attach Fillet Height ReductionWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1947US2023378010A1Power semiconductor devices having moisture barriersWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2045US11562756B2Apparatus and method for post-processing an audio signal using prediction based shapingFRAUNHOFER GES FORSCHUNG·Filed 2019·Granted Jan 24, 2023·0 cites·20 claims
- 2144US2019101078A1Cylinder, method for finishing a cylinder, reciprocating piston system and use of a reciprocating piston systemVOLKSWAGEN AG·Filed 2018·Application pending·0 cites
- 2243US11373666B2Apparatus for post-processing an audio signal using a transient location detectionFRAUNHOFER GES FORSCHUNG·Filed 2019·Granted Jun 28, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →