Inventor · disambiguated record
David W. Shortt
Also filed as: SHORTT DAVID · SHORTT DAVID W
36 granted patents·2 pending applications·666 citations·filing 1990–2023
98Inventor score
Top patents by PatentIndex Score
38 records- 0197US9092846B2Detecting defects on a wafer using defect-specific and multi-channel informationKLA TENCOR CORP·Filed 2014·Granted Jul 28, 2015·30 cites·56 claims
- 0296US9891177B2TDI sensor in a darkfield systemKLA TENCOR CORP·Filed 2014·Granted Feb 13, 2018·56 cites·41 claims
- 0396US7304310B1Methods and systems for inspecting a specimen using light scattered in different wavelength rangesKLA TENCOR TECH CORP·Filed 2003·Granted Dec 4, 2007·89 cites·25 claims
- 0496US6781688B2Process for identifying defects in a substrate having non-uniform surface propertiesKLA TENCOR TECH CORP·Filed 2002·Granted Aug 24, 2004·90 cites·25 claims
- 0595US7199874B2Darkfield inspection system having a programmable light selection arrayKLA TENCOR TECH CORP·Filed 2005·Granted Apr 3, 2007·26 cites·14 claims
- 0693US10082470B2Defect marking for semiconductor wafer inspectionKLA TENCOR CORP·Filed 2017·Granted Sep 25, 2018·9 cites·21 claims
- 0793US9390902B2Method and system for controlling convective flow in a light-sustained plasmaKLA TENCOR CORP·Filed 2014·Granted Jul 12, 2016·13 cites·19 claims
- 0893US7463349B1Systems and methods for determining a characteristic of a specimenKLA TENCOR TECH CORP·Filed 2006·Granted Dec 9, 2008·24 cites·22 claims
- 0992US8947521B1Method for reducing aliasing in TDI based imagingHILL ANDREW V·Filed 2012·Granted Feb 3, 2015·15 cites·23 claims
- 1092US8582094B1Systems and methods for inspecting specimens including specimens that have a substantially rough uppermost layerSHORTT DAVID·Filed 2005·Granted Nov 12, 2013·28 cites·23 claims
- 1191US9846930B2Detecting defects on a wafer using defect-specific and multi-channel informationKLA TENCOR CORP·Filed 2016·Granted Dec 19, 2017·5 cites·17 claims
- 1291US7489393B2Enhanced simultaneous multi-spot inspection and imagingKLA TENCOR TECH CORP·Filed 2005·Granted Feb 10, 2009·19 cites·36 claims
- 1389US7002677B2Darkfield inspection system having a programmable light selection arrayKLA TENCOR TECH CORP·Filed 2003·Granted Feb 21, 2006·31 cites·42 claims
- 1487US7106432B1Surface inspection system and method for using photo detector array to detect defects in inspection surfaceKLA TENCOR TECH CORP·Filed 2002·Granted Sep 12, 2006·35 cites·13 claims
- 1586US9558858B2System and method for imaging a sample with a laser sustained plasma illumination outputKLA TENCOR CORP·Filed 2014·Granted Jan 31, 2017·9 cites·31 claims
- 1686US7554656B2Methods and systems for inspection of a waferKLA TENCOR TECH CORP·Filed 2005·Granted Jun 30, 2009·11 cites·21 claims
- 1785US7436505B2Computer-implemented methods and systems for determining a configuration for a light scattering inspection systemKLA TENCOR TECH CORP·Filed 2006·Granted Oct 14, 2008·12 cites·22 claims
- 1884US9552636B2Detecting defects on a wafer using defect-specific and multi-channel informationKLA TENCOR CORP·Filed 2015·Granted Jan 24, 2017·3 cites·67 claims
- 1984US7061598B1Darkfield inspection system having photodetector arrayKLA TENCOR TECH CORP·Filed 2002·Granted Jun 13, 2006·24 cites·9 claims
- 2084US7009696B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2004·Granted Mar 7, 2006·19 cites·21 claims
- 2182US9297769B1Method for reducing aliasing in TDI based imagingKLA TENCOR CORP·Filed 2015·Granted Mar 29, 2016·3 cites·22 claims
- 2281US7697129B2Systems and methods for inspecting a wafer with increased sensitivityKLA TENCOR TECH CORP·Filed 2006·Granted Apr 13, 2010·6 cites·20 claims
- 2381US7372559B2Systems and methods for inspecting a wafer with increased sensitivityKLA TENCOR TECH CORP·Filed 2005·Granted May 13, 2008·6 cites·26 claims
- 2480US7271921B2Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanningKLA TENCOR TECH CORP·Filed 2004·Granted Sep 18, 2007·24 cites·2 claims
- 2580US6414752B1Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR TECH CORP·Filed 1999·Granted Jul 2, 2002·34 cites·16 claims
- 2676US10317347B2Determining information for defects on wafersKLA TENCOR CORP·Filed 2014·Granted Jun 11, 2019·2 cites·21 claims
- 2769US7796805B1Defect detectionKLA TENCOR CORP·Filed 2005·Granted Sep 14, 2010·2 cites·16 claims
- 2868US7505619B2System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surfaceKLA TENCOR TECH CORP·Filed 2005·Granted Mar 17, 2009·2 cites·30 claims
- 2966US8060962B2Taping knife with hammerSHORTT DAVID·Filed 2009·Granted Nov 22, 2011·3 cites·12 claims
- 3065US10571407B2Determining information for defects on wafersKLA TENCOR CORP·Filed 2019·Granted Feb 25, 2020·0 cites·20 claims
- 3165US6686996B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2002·Granted Feb 3, 2004·7 cites·40 claims
- 3264US2024044799A1Photoluminescence for semiconductor yield related applicationsKLA CORP·Filed 2023·Application pending·0 cites
- 3356US9887076B2Method and system for controlling convective flow in a light-sustained plasmaKLA TENCOR CORP·Filed 2016·Granted Feb 6, 2018·0 cites·18 claims
- 3456US7436506B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2006·Granted Oct 14, 2008·1 cites·20 claims
- 3555US5528366APrecision determination for molecular weightsWYATT TECHNOLOGY·Filed 1994·Granted Jun 18, 1996·18 cites·15 claims
- 3652US7663746B2Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection toolKLA TENCOR TECHOLOGIES CORP·Filed 2008·Granted Feb 16, 2010·1 cites·20 claims
- 3744US5121054AMethod and apparatus for determining the angular velocity of a shaft using a pair of proximity sensorsTECHCO CORP·Filed 1990·Granted Jun 9, 1992·9 cites·15 claims
- 3839US2015377795A1Defect detection using surface enhanced electric fieldKLA TENCOR CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →