Inventor · disambiguated record
De-Yuan Lu
Also filed as: LU DE-YUAN
14 granted patents·4 pending applications·99 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
18 records- 0196US11841618B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·2 cites·20 claims
- 0295US8981559B2Package on package devices and methods of packaging semiconductor diesHSU CHUN-LEI·Filed 2012·Granted Mar 17, 2015·50 cites·20 claims
- 0395US8823166B2Pillar bumps and process for making sameLIN CHENG-CHUNG·Filed 2010·Granted Sep 2, 2014·25 cites·10 claims
- 0490US10861710B2Methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·5 cites·20 claims
- 0589US2025349639A1Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0688US11215929B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·3 cites·20 claims
- 0788US9397080B2Package on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·6 cites·20 claims
- 0887US2025306466A1Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0985US12353134B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1082US12431400B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 1182US9449931B2Pillar bumps and process for making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·4 cites·20 claims
- 1279US2024387193A1Semiconductor devices with external connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1378US11289373B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 1477US11823969B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1569US11848233B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1669US11515224B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1764US2021118697A1Methods of Manufacturing Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 1850US7026580B2Adjustable exhaust flow for thermal uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 11, 2006·2 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →