Inventor · disambiguated record
Dioscoro A. Merilo
Also filed as: MERILO DIOSCORO · MERILO DIOSCORO A
62 granted patents·1 pending application·863 citations·filing 2001–2015
99Inventor score
Files withSTATS CHIPPAC LTD21CAMACHO ZIGMUND R13PAGAILA REZA A8CAMACHO ZIGMUND RAMIREZ5CHOW SENG GUAN2
Top patents by PatentIndex Score
63 records- 0198US9406619B2Semiconductor device including pre-fabricated shielding frame disposed over semiconductor diePAGAILA REZA A·Filed 2012·Granted Aug 2, 2016·46 cites·24 claims
- 0298US8993376B2Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor dieCAMACHO ZIGMUND R·Filed 2011·Granted Mar 31, 2015·52 cites·23 claims
- 0398US8409922B2Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnectCAMACHO ZIGMUND R·Filed 2010·Granted Apr 2, 2013·58 cites·31 claims
- 0498US8263434B2Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoPPAGAILA REZA A·Filed 2009·Granted Sep 11, 2012·110 cites·20 claims
- 0598US8076184B1Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor dieCAMACHO ZIGMUND R·Filed 2010·Granted Dec 13, 2011·43 cites·12 claims
- 0697US8435835B2Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor diePAGAILA REZA A·Filed 2010·Granted May 7, 2013·33 cites·16 claims
- 0796US8241956B2Semiconductor device and method of forming wafer level multi-row etched lead packageCAMACHO ZIGMUND R·Filed 2010·Granted Aug 14, 2012·25 cites·20 claims
- 0896US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 0996US8097489B2Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor diePAGAILA REZA A·Filed 2009·Granted Jan 17, 2012·36 cites·20 claims
- 1094US7535086B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2006·Granted May 19, 2009·34 cites·8 claims
- 1194US7385299B2Stackable integrated circuit package system with multiple interconnect interfaceSTATS CHIPPAC LTD·Filed 2006·Granted Jun 10, 2008·31 cites·17 claims
- 1293US7964450B2Wirebondless wafer level package with plated bumps and interconnectsSTATS CHIPPAC LTD·Filed 2008·Granted Jun 21, 2011·22 cites·36 claims
- 1393US6537848B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Mar 25, 2003·79 cites·13 claims
- 1492US8377750B2Integrated circuit packaging system with multiple row leads and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 19, 2013·14 cites·17 claims
- 1591US7830020B2Integrated circuit package system employing device stackingSTATS CHIPPAC LTD·Filed 2007·Granted Nov 9, 2010·19 cites·15 claims
- 1689US8866275B2Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnectSTATS CHIPPAC LTD·Filed 2013·Granted Oct 21, 2014·8 cites·25 claims
- 1789US8193037B1Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Jun 5, 2012·11 cites·11 claims
- 1888US8525344B2Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor diePAGAILA REZA A·Filed 2011·Granted Sep 3, 2013·9 cites·17 claims
- 1988US7709944B2Integrated circuit package system with package integrationSTATS CHIPPAC LTD·Filed 2007·Granted May 4, 2010·16 cites·22 claims
- 2087US9922955B2Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSPCAMACHO ZIGMUND R·Filed 2010·Granted Mar 20, 2018·9 cites·17 claims
- 2187US9589910B2Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Mar 7, 2017·7 cites·25 claims
- 2286US8105915B2Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layersCAMACHO ZIGMUND R·Filed 2009·Granted Jan 31, 2012·12 cites·25 claims
- 2384US9236352B2Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the diePAGAILA REZA A·Filed 2011·Granted Jan 12, 2016·6 cites·32 claims
- 2482US9337161B2Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2014·Granted May 10, 2016·4 cites·21 claims
- 2582US8241954B2Wafer level die integration and methodCAMACHO ZIGMUND R·Filed 2007·Granted Aug 14, 2012·9 cites·24 claims
- 2682US7986043B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 26, 2011·11 cites·20 claims
- 2781US8304286B2Integrated circuit packaging system with shielded package and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2009·Granted Nov 6, 2012·9 cites·20 claims
- 2880US7859098B2Embedded integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 28, 2010·8 cites·17 claims
- 2979US9142514B2Semiconductor device and method of forming wafer level die integrationCAMACHO ZIGMUND R·Filed 2012·Granted Sep 22, 2015·4 cites·20 claims
- 3079US7911067B2Semiconductor package system with die support padSTATS CHIPPAC LTD·Filed 2008·Granted Mar 22, 2011·6 cites·10 claims
- 3177US8546929B2Embedded integrated circuit package-on-package systemONG YOU YANG·Filed 2006·Granted Oct 1, 2013·8 cites·20 claims
- 3277US7777320B2Quad flat pack in quad flat pack integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 17, 2010·4 cites·16 claims
- 3376US8617933B2Integrated circuit packaging system with interlock and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Dec 31, 2013·4 cites·3 claims
- 3476US8518749B2Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor dieDAHILIG FREDERICK R·Filed 2009·Granted Aug 27, 2013·5 cites·27 claims
- 3576US8502376B2Wirebondless wafer level package with plated bumps and interconnectsCAMACHO ZIGMUND R·Filed 2011·Granted Aug 6, 2013·3 cites·28 claims
- 3676US7985628B2Integrated circuit package system with interconnect lockSTATS CHIPPAC LTD·Filed 2007·Granted Jul 26, 2011·6 cites·20 claims
- 3776US7718472B2Integrated circuit package-on-package stacking system and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted May 18, 2010·5 cites·10 claims
- 3875US8722457B2System and apparatus for wafer level integration of componentsCAMACHO ZIGMUND R·Filed 2007·Granted May 13, 2014·6 cites·25 claims
- 3975US8216883B2Method for manufacturing semiconductor package system with die support padCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jul 10, 2012·3 cites·10 claims
- 4075US7868434B2Integrated circuit package-on-package stacking systemSTATS CHIPPAC LTD·Filed 2010·Granted Jan 11, 2011·3 cites·10 claims
- 4174US7981702B2Integrated circuit package in package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 19, 2011·5 cites·10 claims
- 4273US8536692B2Mountable integrated circuit package system with mountable integrated circuit dieKUAN HEAP HOE·Filed 2007·Granted Sep 17, 2013·5 cites·20 claims
- 4372US8546189B2Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnectionCAMACHO ZIGMUND R·Filed 2009·Granted Oct 1, 2013·4 cites·22 claims
- 4472US8232658B2Stackable integrated circuit package system with multiple interconnect interfaceCHOW SENG GUAN·Filed 2008·Granted Jul 31, 2012·4 cites·20 claims
- 4571US7741707B2Stackable integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jun 22, 2010·4 cites·10 claims
- 4670US6744125B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES PTE LTD·Filed 2003·Granted Jun 1, 2004·18 cites·2 claims
- 4768US8093151B2Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the diePAGAILA REZA A·Filed 2009·Granted Jan 10, 2012·3 cites·32 claims
- 4867US8723324B2Integrated circuit packaging system with pad connection and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted May 13, 2014·2 cites·20 claims
- 4967US8212342B2Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Jul 3, 2012·2 cites·17 claims
- 5066US9293385B2RDL patterning with package on package systemPAGAILA REZA ARGENTY·Filed 2008·Granted Mar 22, 2016·3 cites·10 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →