Inventor · disambiguated record
Dong Hyun Bang
Also filed as: BANG DONG HYUN
13 granted patents·3 pending applications·16 citations·filing 2013–2025
86Inventor score
Top patents by PatentIndex Score
16 records- 0192US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
- 0282US11004801B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 11, 2021·4 cites·20 claims
- 0380US12272655B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 0480US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0578US12187603B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0678US2025233081A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0775US11742300B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 0875US9809446B1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 7, 2017·2 cites·22 claims
- 0972US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1070US11572269B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1168US11355451B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims
- 1261US9056765B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 16, 2015·1 cites·20 claims
- 1360US10822226B2Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 1457US11152296B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
- 1551US10144634B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·0 cites·20 claims
- 1643US2015274511A1Semiconductor Package And Manufacturing Method ThereofAMKOR TECHNOLOGY INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →