Semiconductor Package And Manufacturing Method Thereof

Abstract

Methods and systems for a semiconductor package may comprise a package device comprising at least one semiconductor chip and an active element attached to a substrate and a window with sidewalls forming cavity regions for the package device and coupled to the substrate with an adhesive. An outer edge of the substrate may be flush with an outer surface of the window sidewalls. The window may be plastic and may include an EMI shielding layer, which may be a copper/nickel plating layer. The semiconductor chip may be a MEMS microphone device. The sidewalls and a top plate of the window may be at a right angle to each other. The package may be formed by severing it from an N×M array of package structures resulting in the outer edges being flush.

1 - 20 . (canceled) 
     
     
         21 . A semiconductor package, the package comprising:
 a package device comprising at least one semiconductor chip and an active element attached to a substrate;   a window comprising sidewalls forming cavity regions for the package device, the window being coupled to the substrate with an adhesive on adhering region on the window, wherein an outer edge of the substrate is flush with an outer surface of the window sidewalls.   
     
     
         22 . The package of  claim 21 , wherein said window comprises plastic. 
     
     
         23 . The package of  claim 22 , wherein said window comprises an EMI shielding layer inside the window. 
     
     
         24 . The package of  claim 23 , wherein said EMI shielding layer comprises a copper/nickel plating layer. 
     
     
         25 . The package of  claim 21 , wherein the semiconductor chip is a MEMS microphone device. 
     
     
         26 . The package of  claim 21 , wherein the sidewalls and a top plate of the window are at a right angle to each other. 
     
     
         27 . The package of  claim 21 , wherein the adhesive comprises solder. 
     
     
         28 . The package of  claim 21 , wherein said adhesive comprises a printed adhesive. 
     
     
         29 . The package of  claim 21 , wherein the outer edge of the substrate and the outer surface of the window sidewalls are cut flush. 
     
     
         30 . A semiconductor package, the manufacturing package comprising:
 a package device comprising at least one semiconductor chip and an active element attached to a substrate;   a molded window corresponding to the package device, the window comprising sidewalls forming a cavity region for the package device and an electromagnetic interference (EMI) shielding layer on an inside surface of said window; and   an adhesive on an adhering region on the window;   wherein the window is adhered to the substrate using the adhesive, and wherein an outer edge of the substrate is flush with an outer surface of the window sidewalls   
     
     
         31 . The package of  claim 30 , wherein said window comprises molded plastic. 
     
     
         32 . The package of  claim 30 , wherein said EMI shielding layer comprises a plated copper/nickel layer. 
     
     
         33 . The package of  claim 30 , wherein the semiconductor chip is a MEMS microphone device. 
     
     
         34 . The package of  claim 33 , wherein the active element is a controller. 
     
     
         35 . The package of  claim 30 , wherein the sidewalls and a top plate of the window are at a right angle to each other. 
     
     
         36 . The package of  claim 30 , wherein the adhesive comprises solder. 
     
     
         37 . The package of  claim 30 , wherein the adhesive comprises epoxy. 
     
     
         38 . The package of  claim 30 , wherein the adhesive comprises a printed adhesive. 
     
     
         39 . The package of  claim 30 , wherein the outer edge of the substrate and the outer surface of the window sidewalls are cut flush. 
     
     
         40 . A semiconductor package, the package comprising:
 a lidded package device formed from an N×M package device array on a mother board, wherein:
 each package device of the N×M package device array comprises at least one semiconductor chip and an active element attached to the mother board in a respective cavity region; 
 a molded N×M window array corresponding to the N×M package device array is adhered to the mother board utilizing an adhesive on adhering regions of the window array; and 
 at least one groove separates adjacent windows of the window array and each window of the window array comprising sidewalls for each of the respective cavity regions.