Inventor · disambiguated record
Yung Woo Lee
Also filed as: LEE YUNG WOO
15 granted patents·4 pending applications·62 citations·filing 2013–2024
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
19 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0295US9935083B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 3, 2018·21 cites·20 claims
- 0394US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0494US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0592US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
- 0682US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0780US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0878US12187603B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0977US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1075US9809446B1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 7, 2017·2 cites·22 claims
- 1172US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 1270US11572269B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1361US9056765B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 16, 2015·1 cites·20 claims
- 1460US10822226B2Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 1557US11152296B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
- 1651US10144634B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·0 cites·20 claims
- 1744US9513254B2Microfluidic sensor package structure and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Dec 6, 2016·0 cites·12 claims
- 1843US2015274511A1Semiconductor Package And Manufacturing Method ThereofAMKOR TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 1936US2018134546A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →