Inventor · disambiguated record
Eunnara Cho
Also filed as: CHO EUNNARA
13 granted patents·5 pending applications·16 citations·filing 2013–2024
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0195US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0292US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
- 0383US12451441B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
- 0481US11355449B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0580US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0678US12187603B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0775US9809446B1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 7, 2017·2 cites·22 claims
- 0872US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0970US11572269B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1061US9056765B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 16, 2015·1 cites·20 claims
- 1161US9018741B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 28, 2015·1 cites·24 claims
- 1260US10822226B2Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 1357US11152296B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
- 1456US2018374798A1Semiconductor device having emi shielding structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1551US10144634B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·0 cites·20 claims
- 1647US2016221820A1Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1743US2015274511A1Semiconductor Package And Manufacturing Method ThereofAMKOR TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 1836US2018134546A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →