Semiconductor device having emi shielding structure and related methods

Abstract

An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package. In another embodiment, the electrical connection is made through the substrate.

1 . An electronic device structure having a shielding structure comprising:
 a substrate;   a first electronic component electrically connected to the substrate;   the shielding structure comprising a plurality of conductive pillar structures, wherein the plurality of conductive pillar structures have proximate ends connected to the substrate, are spaced apart from each other, have distal ends spaced apart from the substrate, and are laterally spaced apart from the first electronic component; and   a package body encapsulating the first electronic component and the plurality of conductive spaced-apart pillar structures.   
     
     
         2 . The structure of  claim 1 , wherein:
 the plurality of conductive pillar structures comprises conductive wires extending away from the substrate and disposed in at least one row adjacent the substrate;   the package body extends between adjacent conductive wires; and   the shielding structure further comprises a shielding layer comprising a conductive material;   the shielding layer is disposed adjacent the package body.   
     
     
         3 . The structure of  claim 2 , wherein:
 the substrate includes a dielectric layer and a first circuit pattern and a second circuit pattern disposed adjacent a surface of the dielectric layer and disposed to be spaced apart from each other;   the first electronic component is electrically coupled to the first circuit pattern;   the conductive wires are electrically coupled to the second circuit pattern; and   the shielding layer is electrically coupled to the conductive wires through one or more of the substrate or the package body.   
     
     
         4 . The structure of  claim 3 , wherein each conductive wire comprises:
 a ball-bonding region disposed adjacent to the second circuit pattern; and   an extending wire region vertically extending from the ball-bonding region.   
     
     
         5 . The structure of  claim 3 , wherein the distal ends of the conductive wires are electrically connected to the shielding layer adjacent an outer surface of the package body. 
     
     
         6 . The structure of  claim 5 , wherein the shielding layer further includes protrusions extending inward into the package body to physically contact the distal ends of the conductive wires. 
     
     
         7 . The structure of  claim 2 , wherein the distal ends of the conductive wires are substantially coplanar with an outer surface of the package body. 
     
     
         8 . The structure of  claim 2 , wherein:
 the electronic device further comprises a conductive ground via extending from a first major surface of the substrate to a second major surface of the substrate; and   a first conductive wire is connected to the conductive ground via and the shielding layer.   
     
     
         9 . The structure of  claim 2 , wherein:
 the package body comprises:
 first surfaces each substantially coplanar with edges of the substrate; and 
 a second surface generally perpendicular to the first surfaces; and 
   the shielding layer is disposed adjacent the second surface.   
     
     
         10 . The structure of  claim 9 , wherein the shielding layer is disposed adjacent only the second surface of the package body. 
     
     
         11 . The structure of  claim 9 , wherein a portion of the conductive wires is interposed on the substrate between at least one of the first surfaces and the first electronic die. 
     
     
         12 . The structure of  claim 11 , wherein the portion comprises at least two adjacent rows. 
     
     
         13 . The structure  claim 12 , wherein the at least two adjacent rows are laterally offset with respect to each other. 
     
     
         14 . The structure of  claim 11 , wherein:
 the conductive wires are disposed adjacent each side of the first electronic component;   the electronic device structure further comprises a second electronic component disposed adjacent the substrate; and   another portion of the conductive wires is laterally interposed on the substrate between the first electronic component and the second electronic component.   
     
     
         15 . An electronic device structure having a shielding structure comprising:
 a substrate having a first major surface and an opposing second major surface;   a first electronic component electrically connected to the substrate adjacent the first major surface;   the shielding structure comprising conductive wires having proximate ends attached to the substrate adjacent the first major surface and distal ends spaced apart from the first major surface, wherein the conductive wires are laterally spaced apart from the first electronic component; and   a package body encapsulating the first electronic component and conductive wires.   
     
     
         16 . The structure of  claim 15 , wherein:
 the conductive wires are laterally spaced apart on the substrate so that the package body extends between adjacent conductive wires;   the distal ends of the conductive wires are disconnected from the substrate;   the shielding structure further comprises a shielding layer comprising a conductive material disposed adjacent the package body;   the conductive wires are disposed on all sides of the first electronic component;   the electronic device structure further comprises a second electronic component disposed adjacent the first major surface of the substrate; and   a portion of the conductive wires is interposed between the first electronic component and the second electronic component.   
     
     
         17 . The structure of  claim 16 , wherein:
 the shielding layer is electrically connected to the distal ends of the conductive wires;   another portion of the conductive wires is interposed between an outer edge of the package body and the first electronic component;   the conductive wires and the shielding layer are electrically isolated from the first electronic component and the second electronic component; and   the conductive wires each comprise a ball bonding portion disposed on the first major surface of the substrate and a wire portion extending from the ball bonding portion away from the first major surface.   
     
     
         18 - 20 . (canceled) 
     
     
         21 . An electronic device structure having a shielding structure comprising:
 a substrate having a first electronic component connected to a first major surface of the substrate, wherein the substrate comprises a conductive ground via extending from the first major surface to an opposing second major surface of the substrate;   conductive wires disposed on the first major surface and laterally spaced apart laterally spaced apart from each other and laterally spaced apart from the first electronic component, wherein proximate ends of the conductive wires are disposed adjacent to the substrate and distal ends of the conductive wires extend away from the substrate;   a package body encapsulating the first electronic component and the conductive wires; and   a conductive shielding layer disposed adjacent the package body, wherein:
 the shielding structure comprises the conductive shielding layer and the conductive wires; and 
 a first conductive wire is connected to the conductive ground via and the conductive shielding layer. 
   
     
     
         22 . The structure of  claim 21 , wherein:
 the substrate comprises a second electronic component connected to the substrate;   a first portion of the conductive wires including the first conductive wire is disposed between the first electronic component and the second electronic component; and   a second portion of the conductive wires is disposed between the first electronic component and an edge of the package body.   
     
     
         23 . The structure of  claim 22 , wherein:
 the second portion of the conductive wires comprises at least two rows of conductive wires; and   the at least two rows of conductive wires extend around each peripheral edge of the substrate.