Inventor · disambiguated record
Gi Jung Kim
Also filed as: KIM GI-JUNG
21 granted patents·11 pending applications·130 citations·filing 1997–2024
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11AMKOR TECH SINGAPORE HOLDING PTE LTD7KOREA KUMHO PETROCHEMICAL CO LTD5PARK YOUNG-SOO3AMKOR TECHNOLOGY INC2
Top patents by PatentIndex Score
32 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0295US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0394US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0494US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0592US9035309B23D CMOS image sensors, sensor systems including the samePARK YOUNG-SOO·Filed 2011·Granted May 19, 2015·10 cites·18 claims
- 0683US12451441B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
- 0782US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0881US11355449B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0981US6552337B1Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurementsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 22, 2003·31 cites·18 claims
- 1077US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1176US11976151B2Polymer polyol and process for producing the sameKOREA KUMHO PETROCHEMICAL CO LTD·Filed 2022·Granted May 7, 2024·0 cites·8 claims
- 1272US8293613B2Gettering structures and methods and their applicationPARK YOUNG-SOO·Filed 2010·Granted Oct 23, 2012·2 cites·14 claims
- 1372US7815496B2Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 19, 2010·4 cites·21 claims
- 1469US5980720AMethods of treating crystal-grown wafers for surface defect analysisSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Nov 9, 1999·38 cites·24 claims
- 1567US2024239943A1Stabilizer, polymer polyol prepared using stabilizer and method for preparing polymer polyolKOREA KUMHO PETROCHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 1666US10954345B2Method of preparing monodispersed polymer polyolsKOREA KUMHO PETROCHEMICAL CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·7 claims
- 1761US2023391908A1Method for preparing polymer polyolKOREA KUMHO PETROCHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 1857US11434319B2Method of preparing high solids content polymer polyols having low viscosityKOREA KUMHO PETROCHEMICAL CO LTD·Filed 2019·Granted Sep 6, 2022·0 cites·9 claims
- 1956US7258931B2Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contaminationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 21, 2007·7 cites·6 claims
- 2056US2018374798A1Semiconductor device having emi shielding structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 2153US2008224269A1Gettering structures and methods and their applicationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2246US2008213982A1Method of fabricating semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2345US2013262557A1City facility managing server and systemKIM GI JUNG·Filed 2012·Application pending·0 cites
- 2443US2005016470A1Susceptor and deposition apparatus including the sameFiled 2004·Application pending·0 cites
- 2541US9219656B2Remote managing system and methodLG CNS CO LTD·Filed 2013·Granted Dec 22, 2015·0 cites·19 claims
- 2641US7372150B2Semiconductor wafer having identification indicationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 13, 2008·1 cites·17 claims
- 2741US2006216942A1Wafer carrier for minimizing contacting area with wafersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2838US2013029143A1Multilayer sheet for molding which is highly glossy even after a molding process, and method for preparing sameLG HAUSYS LTD·Filed 2011·Application pending·0 cites
- 2938US2007287280A1Composition for removing a photoresist and method of forming a bump electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3037US8143142B2Method of fabricating epi-wafer, epi-wafer fabricated by the method, and image sensor fabricated using the epi-waferPARK YOUNG-SOO·Filed 2010·Granted Mar 27, 2012·0 cites·12 claims
- 3135US5972863ASlurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing electron wax after polishingSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 26, 1999·5 cites·4 claims
- 3233US6919214B2Apparatus for analyzing a substrate employing a copper decorationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 19, 2005·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →