Inventor · disambiguated record

Jae Ung Lee

Also filed as: LEE JAE-UNG

21 granted patents·5 pending applications·496 citations·filing 2011–2024

94Inventor score

Technology areasH10W C12N G11C

Files withAMKOR TECH SINGAPORE HOLDING PTE LTD11 AMKOR TECHNOLOGY INC11 LEE JAE UNG2 EHLBIO CO LTD1 UNIV HANYANG IND UNIV COOP FOUND1

Top patents by PatentIndex Score

26 records

0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
0297US8873272B2Semiconductor memory apparatus and test circuit thereforLEE JAE UNG·Filed 2011·Granted Oct 28, 2014·409 cites·18 claims
0395US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
0495US9935083B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 3, 2018·21 cites·20 claims
0594US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
0694US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
0792US10032705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·9 cites·18 claims
0892US8921955B1Semiconductor device with micro electromechanical system dieLEE JAE UNG·Filed 2011·Granted Dec 30, 2014·22 cites·20 claims
0983US12451441B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 21, 2025·0 cites·17 claims
1082US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
1181US11355449B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
1280US2024332159A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
1378US12187603B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
1477US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
1575US9809446B1Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 7, 2017·2 cites·22 claims
1672US12009289B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
1770US11572269B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
1861US9018741B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 28, 2015·1 cites·24 claims
1960US10822226B2Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
2060US2025195578A1Medium composition for culturing urine-derived stem cell, method for isolating and culturing urine-derived stem cell using same, urine-derived stem cell with improved therapeutic function for renal disease, and cell therapy product composition containing sameEHLBIO CO LTD·Filed 2022·Application pending·0 cites
2159US12503492B2CRISPR-Cas-based composition for gene correctionUNIV HANYANG IND UNIV COOP FOUND·Filed 2019·Granted Dec 23, 2025·0 cites·12 claims
2257US11152296B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 19, 2021·0 cites·21 claims
2356US2018374798A1Semiconductor device having emi shielding structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Application pending·0 cites
2451US10144634B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·0 cites·20 claims
2544US9513254B2Microfluidic sensor package structure and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Dec 6, 2016·0 cites·12 claims
2641US2015130054A1Semiconductor package structure and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →