Inventor · disambiguated record
Dong Joo Park
Also filed as: PARK DONG JOO
29 granted patents·8 pending applications·245 citations·filing 2007–2025
95Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD19AMKOR TECHNOLOGY INC10ERICSSON LG CO LTD2HYUNDAI MOTOR CO LTD2KIM JIN SEONG2
Top patents by PatentIndex Score
37 records- 0196US8525318B1Semiconductor device and fabricating method thereofKIM JIN SEONG·Filed 2010·Granted Sep 3, 2013·148 cites·19 claims
- 0295US9728476B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 8, 2017·11 cites·7 claims
- 0394US9984947B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 29, 2018·9 cites·13 claims
- 0494US8557629B1Semiconductor device having overlapped via aperturesKIM JIN SEONG·Filed 2010·Granted Oct 15, 2013·31 cites·11 claims
- 0592US11482496B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Oct 25, 2022·3 cites·22 claims
- 0689US11996369B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 28, 2024·1 cites·20 claims
- 0786US11495505B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0886US2024321658A1Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0985US8089145B1Semiconductor device including increased capacity leadframeKIM GWANG HO·Filed 2008·Granted Jan 3, 2012·20 cites·20 claims
- 1083US12002725B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 4, 2024·0 cites·31 claims
- 1183US2025338680A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1282US12494414B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 1382US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1481US9837331B1Semiconductor device having overlapped via aperturesAMKOR TECHNOLOGY INC·Filed 2015·Granted Dec 5, 2017·3 cites·20 claims
- 1579US9177932B1Semiconductor device having overlapped via aperturesAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 1676US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 1776US11682598B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 20, 2023·0 cites·11 claims
- 1875US12356777B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1974US2024395725A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2073US10811341B2Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·1 cites·20 claims
- 2173US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 2273US8457076B2Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA systemKWON SUNG LARK·Filed 2007·Granted Jun 4, 2013·8 cites·8 claims
- 2372US11177187B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 2471US11961775B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·18 claims
- 2569US11869829B2Semiconductor device with through-mold viaAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 9, 2024·0 cites·12 claims
- 2665US11398455B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 26, 2022·1 cites·19 claims
- 2763US10672676B2Sensor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 2860US11545604B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 3, 2023·0 cites·19 claims
- 2960US2023411342A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 3059US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
- 3158US9185713B2Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA systemERICSSON LG CO LTD·Filed 2013·Granted Nov 10, 2015·1 cites·12 claims
- 3257US11746981B2Multi-faceted reflective hidden lighting lamp and vehicle thereofHYUNDAI MOTOR CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·19 claims
- 3357US2023088061A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 3454US11788691B2Hidden lighting lamp using color conversion materials and vehicles having sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 3553US2017117214A1Semiconductor device with through-mold viaAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 3639US9633966B2Stacked semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
- 3735US2015003421A9Apparatus and method for transmitting and receiving a rach signal in sc-fdma systemERICSSON LG CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →