Inventor · disambiguated record
Edward Augustyniak
Also filed as: AUGUSTYNIAK EDWARD · AUGUSTYNIAK EDWARD J
41 granted patents·6 pending applications·706 citations·filing 2002–2024
98Inventor score
Top patents by PatentIndex Score
47 records- 0198US9508547B1Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactorsLAM RES CORP·Filed 2015·Granted Nov 29, 2016·31 cites·20 claims
- 0298US9449795B2Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactorNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 20, 2016·398 cites·22 claims
- 0397US11823928B2Control of wafer bow in multiple stationsLAM RES CORP·Filed 2021·Granted Nov 21, 2023·4 cites·20 claims
- 0496US10665429B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2017·Granted May 26, 2020·6 cites·20 claims
- 0596US10622962B2Combiner and distributor for adjusting impedances or power across multiple plasma processing stationsLAM RES CORP·Filed 2019·Granted Apr 14, 2020·7 cites·18 claims
- 0696US10553465B2Control of water bow in multiple stationsLAM RES CORP·Filed 2017·Granted Feb 4, 2020·18 cites·16 claims
- 0796US9793096B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2015·Granted Oct 17, 2017·16 cites·18 claims
- 0896US9644271B1Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2016·Granted May 9, 2017·21 cites·24 claims
- 0995US10619245B2Hollow cathode discharge (HCD) suppressing capacitively coupled plasma electrode and gas distribution faceplateLAM RES CORP·Filed 2018·Granted Apr 14, 2020·25 cites·25 claims
- 1095US10378107B2Low volume showerhead with faceplate holes for improved flow uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·11 cites·26 claims
- 1195US10287683B2Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate regionLAM RES CORP·Filed 2016·Granted May 14, 2019·6 cites·14 claims
- 1295US8282983B1Closed loop control system for RF power balancing of the stations in a multi-station processing tool with shared RF sourceKAPOOR SUNIL·Filed 2008·Granted Oct 9, 2012·56 cites·12 claims
- 1394US10224182B2Mechanical suppression of parasitic plasma in substrate processing chamberKEIL DOUGLAS·Filed 2011·Granted Mar 5, 2019·17 cites·21 claims
- 1494US10187032B2Combiner and distributor for adjusting impedances or power across multiple plasma processing stationsLAM RES CORP·Filed 2016·Granted Jan 22, 2019·8 cites·26 claims
- 1594US10128160B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2017·Granted Nov 13, 2018·6 cites·20 claims
- 1694US10121708B2Systems and methods for detection of plasma instability by optical diagnosisLAM RES CORP·Filed 2016·Granted Nov 6, 2018·7 cites·17 claims
- 1794US9388494B2Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate regionNOVELLUS SYSTEMS INC·Filed 2012·Granted Jul 12, 2016·16 cites·16 claims
- 1893US11183406B2Control of wafer bow in multiple stationsLAM RES CORP·Filed 2019·Granted Nov 23, 2021·7 cites·24 claims
- 1993US2025070741A1Combiner and distributor for adjusting impedances or power across multiple plasma processing stationsLAM RES CORP·Filed 2024·Application pending·0 cites
- 2091US11725282B2Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate regionNOVELLUS SYSTEMS INC·Filed 2021·Granted Aug 15, 2023·1 cites·12 claims
- 2191US10081869B2Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substratesLAM RES CORP·Filed 2014·Granted Sep 25, 2018·9 cites·20 claims
- 2289US11111581B2Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate regionLAM RES CORP·Filed 2019·Granted Sep 7, 2021·3 cites·9 claims
- 2389US10077497B2Hollow cathode discharge (HCD) suppressing capacitively coupled plasma electrode and gas distribution faceplateLAM RES CORP·Filed 2015·Granted Sep 18, 2018·6 cites·31 claims
- 2487US12308216B2Mechanical suppression of parasitic plasma in substrate processing chamberLAM RES CORP·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 2587US11393729B2Systems and methods for controlling plasma instability in semiconductor fabricationLAM RES CORP·Filed 2019·Granted Jul 19, 2022·2 cites·20 claims
- 2687US9824941B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2016·Granted Nov 21, 2017·3 cites·21 claims
- 2784US11862435B2Mechanical suppression of parasitic plasma in substrate processing chamberLAM RES CORP·Filed 2023·Granted Jan 2, 2024·0 cites·12 claims
- 2883US10510625B2Systems and methods for controlling plasma instability in semiconductor fabricationLAM RES CORP·Filed 2016·Granted Dec 17, 2019·2 cites·20 claims
- 2983US9997422B2Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instabilityLAM RES CORP·Filed 2016·Granted Jun 12, 2018·2 cites·20 claims
- 3082US12143087B2Combiner and distributor for adjusting impedances or power across multiple plasma processing stationsLAM RES CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 3180US2024055285A1Control of wafer bow in multiple stationsLAM RES CORP·Filed 2023·Application pending·0 cites
- 3275US2023246624A1Systems and methods for providing shunt cancellation of parasitic components in a plasma reactorLAM RES CORP·Filed 2023·Application pending·0 cites
- 3374US8192806B1Plasma particle extraction process for PECVDVARADARAJAN SESHA·Filed 2008·Granted Jun 5, 2012·10 cites·12 claims
- 3469US11258421B2Combiner and distributor for adjusting impedances or power across multiple plasma processing stationsLAM RES CORP·Filed 2020·Granted Feb 22, 2022·0 cites·22 claims
- 3569US11127567B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2020·Granted Sep 21, 2021·0 cites·24 claims
- 3666US11621150B2Mechanical suppression of parasitic plasma in substrate processing chamberLAM RES CORP·Filed 2019·Granted Apr 4, 2023·0 cites·19 claims
- 3765US10876209B2Systems and methods for determining film thickness using DC self-bias voltageNOVELLUS SYSTEMS INC·Filed 2019·Granted Dec 29, 2020·0 cites·7 claims
- 3865US6716765B1Plasma clean for a semiconductor thin film deposition chamberNOVELLUS SYSTEMS INC·Filed 2002·Granted Apr 6, 2004·8 cites·13 claims
- 3957US10378109B2Diagnostic and control systems and methods for substrate processing systems using DC self-bias voltageNOVELLUS SYSTEMS INC·Filed 2016·Granted Aug 13, 2019·0 cites·7 claims
- 4057US9404183B2Diagnostic and control systems and methods for substrate processing systems using DC self-bias voltageNOVELLUS SYSTEMS INC·Filed 2013·Granted Aug 2, 2016·0 cites·18 claims
- 4153US9941113B2Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2017·Granted Apr 10, 2018·0 cites·24 claims
- 4251US9875883B2Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matchingLAM RES CORP·Filed 2017·Granted Jan 23, 2018·0 cites·18 claims
- 4351US2018175819A1Systems and methods for providing shunt cancellation of parasitic components in a plasma reactorLAM RES CORP·Filed 2016·Application pending·0 cites
- 4448US9754769B2Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matchingLAM RES CORP·Filed 2015·Granted Sep 5, 2017·0 cites·18 claims
- 4542US9953887B2Measuring individual layer thickness during multi-layer deposition semiconductor processingLAM RES CORP·Filed 2016·Granted Apr 24, 2018·0 cites·8 claims
- 4636US2012164834A1Variable-Density Plasma Processing of Semiconductor SubstratesJENNINGS KEVIN·Filed 2010·Application pending·0 cites
- 4733US2016289827A1Plasma processing systems and structures having sloped confinement ringsLAM RES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →