Inventor · disambiguated record
Eiji Iwamura
Also filed as: IWAMURA EIJI
16 granted patents·3 pending applications·378 citations·filing 1980–2018
93Inventor score
Top patents by PatentIndex Score
19 records- 0195US6562445B2Diamond-like carbon hard multilayer film and component excellent in wear resistance and sliding performanceKOBE STEEL LTD·Filed 2001·Granted May 13, 2003·86 cites·13 claims
- 0291US5514909AAluminum alloy electrode for semiconductor devicesKOBE STEEL LTD·Filed 1994·Granted May 7, 1996·93 cites·11 claims
- 0390US6033542AElectrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devicesKOBE STEEL LTD·Filed 1995·Granted Mar 7, 2000·88 cites·5 claims
- 0489US6599492B2Onion-like carbon film and its productionKOBE STEEL LTD·Filed 2001·Granted Jul 29, 2003·30 cites·13 claims
- 0584US6716540B2Multilayer film formed bodyKOBE STEEL LTD·Filed 2002·Granted Apr 6, 2004·28 cites·19 claims
- 0671US8323752B2Carbon-based thin film, and process for producing the same, and member using the thin filmIWAMURA EIJI·Filed 2005·Granted Dec 4, 2012·2 cites·9 claims
- 0769US6815962B2Connection/inspection device for semiconductor elementsKOBE STEEL LTD·Filed 2002·Granted Nov 9, 2004·13 cites·20 claims
- 0867US9346993B2Heat dissipating coating composition and heat dissipating coating filmARAKAWA CHEM IND·Filed 2013·Granted May 24, 2016·1 cites·13 claims
- 0967US4402037ACathode-ray tube socket substrateMURATA MANUFACTURING CO·Filed 1980·Granted Aug 30, 1983·14 cites·4 claims
- 1060US9314879B2Lead-free solder flux and lead-free solder pasteKUBO NATSUKI·Filed 2011·Granted Apr 19, 2016·2 cites·7 claims
- 1152US5797690APrinter and method of adjusting print densitySTAR MFG CO·Filed 1996·Granted Aug 25, 1998·14 cites·8 claims
- 1246USRE44239EElectrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devicesYAMAMOTO SEIGO·Filed 2006·Granted May 28, 2013·0 cites·10 claims
- 1346USRE43590EAluminum alloy electrode for semiconductor devicesYAMAMOTO SEIGO·Filed 2006·Granted Aug 21, 2012·0 cites·31 claims
- 1446US2016024366A1Heat-dissapating powder coating composition, heat-dissipating coating film, and coated articlePELNOX LTD·Filed 2014·Application pending·0 cites
- 1541US6333267B1Method of manufacturing active matrix type liquid crystal displayKOBE STEEL LTD·Filed 1995·Granted Dec 25, 2001·7 cites·3 claims
- 1640US8178471B2Hydrogen storage materials and process for the preparation of the sameIWAMURA EIJI·Filed 2004·Granted May 15, 2012·0 cites·6 claims
- 1732US11081263B2Chip-shaped electronic componentPELNOX LTD·Filed 2018·Granted Aug 3, 2021·0 cites·16 claims
- 1831US2012291922A1Solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
- 1930US2012291921A1Flux for solder paste, and solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →