Inventor · disambiguated record
Eric Yakobson
Also filed as: YAKOBSON ERIC
25 granted patents·2 pending applications·355 citations·filing 1994–2025
96Inventor score
Top patents by PatentIndex Score
27 records- 0189US7332193B2Cobalt and nickel electroless plating in microelectronic devicesENTHONE·Filed 2005·Granted Feb 19, 2008·16 cites·17 claims
- 0286US5733599AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1996·Granted Mar 31, 1998·53 cites·8 claims
- 0385US5935640AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1997·Granted Aug 10, 1999·46 cites·5 claims
- 0483USRE45881EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Feb 9, 2016·2 cites·8 claims
- 0583US7393781B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2007·Granted Jul 1, 2008·10 cites·24 claims
- 0682USRE45297EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Dec 23, 2014·2 cites·7 claims
- 0782US7682432B2Adhesion promotion in printed circuit boardsENTHONE·Filed 2007·Granted Mar 23, 2010·3 cites·39 claims
- 0882US6440647B1Resist stripping processALPHA METALS·Filed 2000·Granted Aug 27, 2002·21 cites·20 claims
- 0981US7232478B2Adhesion promotion in printed circuit boardsENTHONE·Filed 2003·Granted Jun 19, 2007·16 cites·5 claims
- 1080US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 1176US5759378AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1997·Granted Jun 2, 1998·32 cites·16 claims
- 1274US5632927AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1996·Granted May 27, 1997·24 cites·12 claims
- 1373US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 1473USRE45842EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Jan 12, 2016·2 cites·22 claims
- 1573US8142840B2Adhesion promotion in printed circuit boardsOWEI ABAYOMI I·Filed 2007·Granted Mar 27, 2012·1 cites·21 claims
- 1673US6436276B1Cathodic photoresist stripping processPOLYCLAD LAMINATES INC·Filed 2000·Granted Aug 20, 2002·8 cites·6 claims
- 1772US5536386AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1995·Granted Jul 16, 1996·23 cites·18 claims
- 1872US5468515AComposition and method for selective platingMACDERMID INC·Filed 1994·Granted Nov 21, 1995·31 cites·10 claims
- 1968US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 2066US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 2166US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 2266US5518760AComposition and method for selective platingMACDERMID INC·Filed 1995·Granted May 21, 1996·28 cites·9 claims
- 2364US9040117B2Adhesion promotion in printed circuit boardsOWEI ABAYOMI I·Filed 2012·Granted May 26, 2015·0 cites·16 claims
- 2462US7268074B2Capping of metal interconnects in integrated circuit electronic devicesENTHONE·Filed 2004·Granted Sep 11, 2007·9 cites·17 claims
- 2561US6294220B1Post-treatment for copper on printed circuit boardsALPHA METALS·Filed 1999·Granted Sep 25, 2001·25 cites·14 claims
- 2657US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 2750US2014256083A1High Speed Copper Plating ProcessMACDERMID ACUMEN INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →