Inventor · disambiguated record
Eun Sook Sohn
Also filed as: SOHN EUN SOOK
12 granted patents·1 pending application·248 citations·filing 2003–2024
91Inventor score
Files withAMKOR TECHNOLOGY INC7AMKOR TECH SINGAPORE HOLDING PTE LTD2SOHN EUN SOOK2HWANG CHAN HA1PAEK JONG SIK1
Top patents by PatentIndex Score
13 records- 0197US8362612B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·53 cites·20 claims
- 0295US8026589B1Reduced profile stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 27, 2011·67 cites·25 claims
- 0392US8193624B1Semiconductor device having improved contact interface reliability and method thereforSOHN EUN SOOK·Filed 2008·Granted Jun 5, 2012·40 cites·11 claims
- 0491US8492893B1Semiconductor device capable of preventing dielectric layer from crackingSOHN EUN SOOK·Filed 2011·Granted Jul 23, 2013·18 cites·16 claims
- 0587US6936922B1Semiconductor package structure reducing warpage and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 30, 2005·49 cites·20 claims
- 0682US8618658B1Semiconductor device and fabricating method thereofPAEK JONG SIK·Filed 2010·Granted Dec 31, 2013·7 cites·13 claims
- 0782US2025029899A1Electronic package structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0877US9929075B2Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivityAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 27, 2018·2 cites·20 claims
- 0977US8487420B1Package in package semiconductor device with film over wireHWANG CHAN HA·Filed 2008·Granted Jul 16, 2013·10 cites·18 claims
- 1072US9524906B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Dec 20, 2016·2 cites·20 claims
- 1171US12131982B2Electronic package structure with reduced vertical stress regionsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 1256US11011455B2Electronic package structure with improved board level reliabilityAMKOR TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·0 cites·18 claims
- 1354US10483222B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →