Inventor · disambiguated record
Fen Dai
Also filed as: DAI FEN
8 granted patents·242 citations·filing 1998–2019
88Inventor score
Top patents by PatentIndex Score
8 records- 0196US10678738B2Memory extensible chipHUAWEI TECH CO LTD·Filed 2019·Granted Jun 9, 2020·24 cites·18 claims
- 0296US6561889B1Methods for making reinforced wafer polishing pads and apparatuses implementing the sameLAM RES CORP·Filed 2000·Granted May 13, 2003·83 cites·35 claims
- 0391US6572463B1Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the sameLAM RES CORP·Filed 2000·Granted Jun 3, 2003·56 cites·27 claims
- 0485US11264249B2Carbon containing hardmask removal process using sulfur containing process gasMATTSON TECH INC·Filed 2019·Granted Mar 1, 2022·4 cites·18 claims
- 0574US6949020B2Methods for making reinforced wafer polishing pads and apparatuses implementing the sameLAM RES CORP·Filed 2003·Granted Sep 27, 2005·13 cites·16 claims
- 0674US6261158B1Multi-step chemical mechanical polishingSPEEDFAM IPEC·Filed 1998·Granted Jul 17, 2001·57 cites·42 claims
- 0771US10069947B2Method and apparatus for processing data packet based on parallel protocol stack instancesHUAWEI TECH CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·20 claims
- 0863US9497035B2Method, device, and system for playing media based on P2PDAI FEN·Filed 2010·Granted Nov 15, 2016·3 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →