Inventor · disambiguated record
Fred E. Stanke
Also filed as: STANKE FRED · STANKE FRED E
45 granted patents·1 pending application·1,961 citations·filing 1989–2015
99Inventor score
Files withTOKYO ELECTRON LTD14THERMA WAVE INC12SENSYS INSTR CORP9SCHLUMBERGER TECHNOLOGY CORP6KLA TENCOR CORP2
Top patents by PatentIndex Score
46 records- 0199US6819426B2Overlay alignment metrology using diffraction gratingsTHERMA WAVE INC·Filed 2002·Granted Nov 16, 2004·373 cites·31 claims
- 0298US6753961B1Spectroscopic ellipsometer without rotating componentsTHERMA WAVE INC·Filed 2001·Granted Jun 22, 2004·154 cites·29 claims
- 0397US6768967B2Database interpolation method for optical measurement of diffractive microstructuresTHERMA WAVE INC·Filed 2001·Granted Jul 27, 2004·110 cites·47 claims
- 0495US6690473B1Integrated surface metrologySENSYS INSTR CORP·Filed 2000·Granted Feb 10, 2004·110 cites·9 claims
- 0595US6340602B1Method of measuring meso-scale structures on wafersSENSYS INSTR·Filed 2001·Granted Jan 22, 2002·105 cites·20 claims
- 0694US9165742B1Inspection site preparationKLA TENCOR CORP·Filed 2015·Granted Oct 20, 2015·21 cites·33 claims
- 0794US7042569B2Overlay alignment metrology using diffraction gratingsTOKYO ELECTRON LTD·Filed 2004·Granted May 9, 2006·70 cites·12 claims
- 0894US6778273B2Polarimetric scatterometer for critical dimension measurements of periodic structuresTHERMA WAVE INC·Filed 2002·Granted Aug 17, 2004·51 cites·12 claims
- 0994US6623991B2Method of measuring meso-scale structures on wafersTHERMA WAVE INC·Filed 2001·Granted Sep 23, 2003·57 cites·12 claims
- 1093US6806105B2Method of measuring meso-scale structures on wafersTHERMA WAVE INC·Filed 2003·Granted Oct 19, 2004·49 cites·2 claims
- 1193US6182510B1Apparatus and method for characterizing semiconductor wafers during processingSENSYS INSTR CORP·Filed 2000·Granted Feb 6, 2001·57 cites·20 claims
- 1293US5717169AMethod and apparatus for inspecting well bore casingSCHLUMBERGER TECHNOLOGY CORP·Filed 1996·Granted Feb 10, 1998·171 cites·6 claims
- 1391US4928269ADetermining impedance of material behind a casing in a boreholeSCHLUMBERGER TECHNOLOGY CORP·Filed 1989·Granted May 22, 1990·80 cites·67 claims
- 1489US7289219B2Polarimetric scatterometry methods for critical dimension measurements of periodic structuresTOKYO ELECTRON LTD·Filed 2005·Granted Oct 30, 2007·10 cites·20 claims
- 1589US6563586B1Wafer metrology apparatus and methodTHERMA WAVE INC·Filed 2000·Granted May 13, 2003·44 cites·25 claims
- 1689US5996415AApparatus and method for characterizing semiconductor wafers during processingSENSYS INSTR CORP·Filed 1997·Granted Dec 7, 1999·79 cites·22 claims
- 1788US6829054B2Integrated surface metrologySENSYS INSTR CORP·Filed 2003·Granted Dec 7, 2004·37 cites·6 claims
- 1880US6909507B2Polarimetric scatterometry methods for critical dimension measurements of periodic structuresTHERMA WAVE INC·Filed 2004·Granted Jun 21, 2005·12 cites·18 claims
- 1978US7069182B2Database interpolation method for optical measurement of diffractive microstructuresTOKYO ELECTRON LTD·Filed 2005·Granted Jun 27, 2006·6 cites·17 claims
- 2078US6667805B2Small-spot spectrometry instrument with reduced polarizationSENSYS INSTR CORP·Filed 2001·Granted Dec 23, 2003·15 cites·25 claims
- 2178US6188643B1Method and apparatus for inspecting well bore casingSCHLUMBERGER TECHNOLOGY CORP·Filed 1994·Granted Feb 13, 2001·34 cites·18 claims
- 2277US7177019B2Apparatus for imaging metrologyTOKYO ELECTRON LTD·Filed 2005·Granted Feb 13, 2007·6 cites·16 claims
- 2374US7471392B2Polarimetric scatterometry methods for critical dimension measurements of periodic structuresTOKYO ELECTRON LTD·Filed 2007·Granted Dec 30, 2008·2 cites·20 claims
- 2474US6510395B2Method of detecting residue on a polished waferSENSYS INSTR CORP·Filed 2001·Granted Jan 21, 2003·11 cites·24 claims
- 2574US6112595AApparatus and method for characterizing semiconductor wafers during processingSENSYS INSTR CORP·Filed 1999·Granted Sep 5, 2000·32 cites·11 claims
- 2674US5859811AMethod of analyzing waveformsSCHLUMBERGER TECHNOLOGY CORP·Filed 1996·Granted Jan 12, 1999·55 cites·29 claims
- 2774US5274604AMethod for spatially filtering signals representing formation and channel echoes in a borehole environmentSCHLUMBERGER TECHNOLOGY CORP·Filed 1992·Granted Dec 28, 1993·45 cites·27 claims
- 2873US6018496AMethod and apparatus for hydraulic isolation determinationSCHLUMBERGER TECHNOLOGY CORP·Filed 1995·Granted Jan 25, 2000·68 cites·56 claims
- 2972US7099081B2Small-spot spectrometry instrument with reduced polarization and multiple-element depolarizer thereforTOKYO ELECTRON LTD·Filed 2002·Granted Aug 29, 2006·10 cites·7 claims
- 3071US6850333B1Optimized aperture shape for optical CD/profile metrologyTHERMA WAVE INC·Filed 2001·Granted Feb 1, 2005·16 cites·16 claims
- 3169US7924422B2Calibration method for optical metrologyTOKYO ELECTRON LTD·Filed 2009·Granted Apr 12, 2011·5 cites·16 claims
- 3269US7446888B2Matching optical metrology tools using diffraction signalsTOKYO ELECTRON LTD·Filed 2006·Granted Nov 4, 2008·6 cites·25 claims
- 3367US7158229B2Small-spot spectrometry instrument with reduced polarization and multiple-element depolarizer thereforTOKYO ELECTRON LTD·Filed 2006·Granted Jan 2, 2007·3 cites·32 claims
- 3467US6019000AIn-situ measurement of deposition on reactor chamber membersSENSYS INSTR CORP·Filed 1997·Granted Feb 1, 2000·30 cites·20 claims
- 3565US7446887B2Matching optical metrology tools using hypothetical profilesTOKYO ELECTRON LTD·Filed 2006·Granted Nov 4, 2008·2 cites·25 claims
- 3664US7042580B1Apparatus for imaging metrologyTOKYO ELECTRON LTD·Filed 2000·Granted May 9, 2006·10 cites·15 claims
- 3763US6919958B2Wafer metrology apparatus and methodTHERMA WAVE INC·Filed 2003·Granted Jul 19, 2005·7 cites·3 claims
- 3854US6950780B2Database interpolation method for optical measurement of diffractive microstructuresTOKYO ELECTRON LTD·Filed 2004·Granted Sep 27, 2005·0 cites·10 claims
- 3953US8107073B2Diffraction order sorting filter for optical metrologyNORTON ADAM·Filed 2009·Granted Jan 31, 2012·2 cites·16 claims
- 4050US7049633B2Method of measuring meso-scale structures on wafersTOKYO ELECTRON LTD·Filed 2004·Granted May 23, 2006·2 cites·4 claims
- 4150US6870617B2Accurate small-spot spectrometry systems and methodsTHERMA WAVE INC·Filed 2004·Granted Mar 22, 2005·2 cites·16 claims
- 4250US6738136B2Accurate small-spot spectrometry instrumentTHERMA WAVE INC·Filed 2002·Granted May 18, 2004·2 cites·12 claims
- 4348US7248362B2Small-spot spectrometry instrument with reduced polarization and multiple-element depolarizer thereforTOKYO ELECTRON LTD·Filed 2006·Granted Jul 24, 2007·0 cites·21 claims
- 4445US9619878B2Inspecting high-resolution photolithography masksKLA TENCOR CORP·Filed 2014·Granted Apr 11, 2017·0 cites·20 claims
- 4539US2002018217A1Optical critical dimension metrology system integrated into semiconductor wafer process toolFiled 2001·Application pending·0 cites
- 4631US6572456B2Bathless wafer measurement apparatus and methodSENSYS INSTR CORP·Filed 2001·Granted Jun 3, 2003·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →