Inventor · disambiguated record
Fumitsugu Fukuyo
Also filed as: FUKUYO FUMITSUGU
68 granted patents·5 pending applications·2,437 citations·filing 2003–2022
99Inventor score
Files withHAMAMATSU PHOTONICS KK38FUKUYO FUMITSUGU21FUJII YOSHIMARO6FUKUMITSU KENSHI5HONDA YOSHINORI2
Top patents by PatentIndex Score
73 records- 0199US8283595B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2009·Granted Oct 9, 2012·68 cites·59 claims
- 0299US7825350B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 2, 2010·126 cites·44 claims
- 0399US7732730B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 8, 2010·139 cites·7 claims
- 0499US7626137B2Laser cutting by forming a modified region within an object and generating fracturesHAMAMATSU PHOTONICS KK·Filed 2005·Granted Dec 1, 2009·130 cites·24 claims
- 0599US7615721B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 10, 2009·118 cites·12 claims
- 0699US7592238B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Sep 22, 2009·123 cites·42 claims
- 0799US7566635B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2006·Granted Jul 28, 2009·172 cites·16 claims
- 0899US7547613B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 16, 2009·144 cites·12 claims
- 0999US7396742B2Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the objectHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jul 8, 2008·167 cites·62 claims
- 1099US6992026B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2003·Granted Jan 31, 2006·447 cites·38 claims
- 1198US8227724B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2010·Granted Jul 24, 2012·31 cites·10 claims
- 1298US7749867B2Method of cutting processed objectHAMAMATSU PHOTONICS KK·Filed 2003·Granted Jul 6, 2010·130 cites·3 claims
- 1397US8314013B2Semiconductor chip manufacturing methodFUJII YOSHIMARO·Filed 2010·Granted Nov 20, 2012·23 cites·6 claims
- 1497US8304325B2Substrate dividing methodFUJII YOSHIMARO·Filed 2007·Granted Nov 6, 2012·25 cites·6 claims
- 1597US8183131B2Method of cutting an object to be processedFUKUYO FUMITSUGU·Filed 2009·Granted May 22, 2012·27 cites·9 claims
- 1697US7489454B2Laser processing deviceHAMAMATSU PHOTONICS KK·Filed 2003·Granted Feb 10, 2009·117 cites·5 claims
- 1796US8927900B2Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 6, 2015·14 cites·5 claims
- 1896US8685838B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Apr 1, 2014·93 cites·9 claims
- 1996US8518800B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·13 cites·7 claims
- 2096US8058103B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2009·Granted Nov 15, 2011·34 cites·8 claims
- 2195US9837315B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2014·Granted Dec 5, 2017·8 cites·7 claims
- 2295US9543207B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·6 cites·29 claims
- 2395US8969761B2Method of cutting a wafer-like object and semiconductor chipFUKUYO FUMITSUGU·Filed 2010·Granted Mar 3, 2015·10 cites·47 claims
- 2495US8519511B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·10 cites·3 claims
- 2594US10068801B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2017·Granted Sep 4, 2018·4 cites·5 claims
- 2694US8673745B2Method of cutting object to be processedHAMAMATSU PHOTONICS KK·Filed 2013·Granted Mar 18, 2014·9 cites·8 claims
- 2794US8551865B2Method of cutting an object to be processedFUKUYO FUMITSUGU·Filed 2012·Granted Oct 8, 2013·10 cites·3 claims
- 2894US8518801B2Substrate dividing methodFUJII YOSHIMARO·Filed 2012·Granted Aug 27, 2013·8 cites·4 claims
- 2993US9548246B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 17, 2017·4 cites·24 claims
- 3092US10796959B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2017·Granted Oct 6, 2020·3 cites·7 claims
- 3191US11424162B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2021·Granted Aug 23, 2022·1 cites·2 claims
- 3291US9553023B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 24, 2017·3 cites·20 claims
- 3391US8268704B2Method for dicing substrateFUJII YOSHIMARO·Filed 2003·Granted Sep 18, 2012·25 cites·56 claims
- 3490US8624153B2Laser processing method and deviceATSUMI KAZUHIRO·Filed 2004·Granted Jan 7, 2014·40 cites·8 claims
- 3590US8263479B2Method for cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2003·Granted Sep 11, 2012·44 cites·39 claims
- 3688US9543256B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted Jan 10, 2017·2 cites·30 claims
- 3788US8716110B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted May 6, 2014·3 cites·8 claims
- 3887US8946592B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 3987US8946591B2Method of manufacturing a semiconductor device formed using a substrate cutting methodFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 4087US8450187B2Method of cutting semiconductor substrateFUKUYO FUMITSUGU·Filed 2012·Granted May 28, 2013·6 cites·12 claims
- 4186US8551817B2Semiconductor substrate cutting methodFUKUMITSU KENSHI·Filed 2011·Granted Oct 8, 2013·6 cites·12 claims
- 4285US8247734B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Aug 21, 2012·29 cites·9 claims
- 4384US8598015B2Laser processing methodFUKUYO FUMITSUGU·Filed 2012·Granted Dec 3, 2013·3 cites·18 claims
- 4484US2022352026A1Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 4581US9711405B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2015·Granted Jul 18, 2017·1 cites·2 claims
- 4680US10622255B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2018·Granted Apr 14, 2020·0 cites·20 claims
- 4780US9142458B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2014·Granted Sep 22, 2015·1 cites·12 claims
- 4879US9287177B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2015·Granted Mar 15, 2016·1 cites·12 claims
- 4979US8889525B2Substrate dividing methodHAMAMATSU PHOTONICS KK·Filed 2013·Granted Nov 18, 2014·1 cites·12 claims
- 5079US8865566B2Method of cutting semiconductor substrateHAMAMATSU PHOTONICS KK·Filed 2013·Granted Oct 21, 2014·3 cites·12 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →