Inventor · disambiguated record
Gi Jeong Kim
Also filed as: KIM GI JEONG
45 granted patents·17 pending applications·325 citations·filing 2000–2025
98Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD25AMKOR TECHNOLOGY INC23HANMI PHARM IND CO LTD5KIM GI JEONG4HANMI PHARM CO1
Top patents by PatentIndex Score
62 records- 0195US8008758B1Semiconductor device with increased I/O leadframeAMKOR TECHNOLOGY INC·Filed 2008·Granted Aug 30, 2011·30 cites·21 claims
- 0295US7875963B1Semiconductor device including leadframe having power bars and increased I/OAMKOR TECHNOLOGY INC·Filed 2008·Granted Jan 25, 2011·35 cites·21 claims
- 0394US8188579B1Semiconductor device including leadframe having power bars and increased I/OKIM GI JEONG·Filed 2010·Granted May 29, 2012·19 cites·20 claims
- 0493US9966652B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·8 cites·22 claims
- 0593US7989933B1Increased I/O leadframe and semiconductor device including sameAMKOR TECHNOLOGY INC·Filed 2008·Granted Aug 2, 2011·23 cites·20 claims
- 0692US10049954B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 14, 2018·7 cites·14 claims
- 0790US11887916B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 30, 2024·2 cites·14 claims
- 0890US11508635B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·2 cites·19 claims
- 0990US6515116B2Method of preparing form II crystals of clarithromycinHANMI PHARM CO·Filed 2001·Granted Feb 4, 2003·68 cites·18 claims
- 1088US8184453B1Increased capacity semiconductor packageKIM JAE YOON·Filed 2008·Granted May 22, 2012·31 cites·20 claims
- 1186US2024404902A1Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1285US11018079B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2017·Granted May 25, 2021·3 cites·13 claims
- 1384US12476171B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Nov 18, 2025·0 cites·15 claims
- 1483US8432023B1Increased I/O leadframe and semiconductor device including sameKIM GI JEONG·Filed 2011·Granted Apr 30, 2013·6 cites·20 claims
- 1582US12062833B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1682US10685897B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 16, 2020·2 cites·20 claims
- 1782US9029992B2Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframeAMKOR TECHNOLOGY INC·Filed 2013·Granted May 12, 2015·6 cites·20 claims
- 1882US2024258225A1Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1982US2025029899A1Electronic package structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2081US2025309070A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2180US12062588B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 2280US8674485B1Semiconductor device including leadframe with downsetsKIM GI JEONG·Filed 2010·Granted Mar 18, 2014·6 cites·20 claims
- 2379US12334420B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2479US6424023B1Leadframe for molded semiconductor package and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·24 cites·26 claims
- 2578US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
- 2677US9929075B2Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivityAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 27, 2018·2 cites·20 claims
- 2775US9431334B2Semiconductor device having single layer substrate and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·2 cites·20 claims
- 2874US8823152B1Semiconductor device with increased I/O leadframeKIM GI JEONG·Filed 2011·Granted Sep 2, 2014·3 cites·20 claims
- 2972US11961794B2Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 3072US11908779B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 3172US9552999B2Packaged electronic device having reduced parasitic effects and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·2 cites·20 claims
- 3272US2024387333A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3371US12131982B2Electronic package structure with reduced vertical stress regionsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 3471US11677135B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 3570US9922919B2Electronic package structure having insulated substrate with lands and conductive patternsAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 20, 2018·1 cites·6 claims
- 3670US7205394B2Clathrate of azithromycin hydrate with 1,2-propyleneglycol, method for the manufacture thereof and pharmaceutical composition comprising sameHANMI PHARM IND CO LTD·Filed 2002·Granted Apr 17, 2007·4 cites·6 claims
- 3770US7205395B2Process of preparing azithromycin and crystalline 9-deoxo-9a-aza-9a-homoerythromycin A hydrate used thereinHANMI PHARM IND CO LTD·Filed 2002·Granted Apr 17, 2007·4 cites·9 claims
- 3869US9911685B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·1 cites·17 claims
- 3968US12444669B2Semiconductor devices with floating pad and their methods of manufacturingAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 4068US7009283B1Nonexposed heat sink for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 7, 2006·18 cites·38 claims
- 4165US7091594B1Leadframe type semiconductor package having reduced inductance and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2004·Granted Aug 15, 2006·13 cites·20 claims
- 4262US12057378B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 4360US2025357284A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4459US10910298B2Method of forming a molded substrate electronic package and structureAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 2, 2021·0 cites·15 claims
- 4557US2025329620A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4657US2025349638A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4756US11011455B2Electronic package structure with improved board level reliabilityAMKOR TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·0 cites·18 claims
- 4856US2025087546A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 4954US2024096725A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 5054US2024096766A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →