Inventor · disambiguated record
Guang-Hwa Ma
Also filed as: MA GUANG-HWA
25 granted patents·11 pending applications·154 citations·filing 2007–2025
94Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD11UNITED MICROELECTRONICS CORP9UNIMICRON TECHNOLOGY CORP7YU CHIH-HAO4LIN CHIEN-TING2
Top patents by PatentIndex Score
36 records- 0196US7932146B2Metal gate transistor and polysilicon resistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·52 cites·19 claims
- 0292US8404535B2Metal gate transistor and method for fabricating the sameYU CHIH-HAO·Filed 2011·Granted Mar 26, 2013·15 cites·16 claims
- 0392US8084824B2Metal gate transistor and method for fabricating the sameYU CHIH-HAO·Filed 2008·Granted Dec 27, 2011·22 cites·6 claims
- 0491US8193050B2Method for fabricating semiconductor structureYU CHIH-HAO·Filed 2010·Granted Jun 5, 2012·12 cites·15 claims
- 0591US7799630B2Method for manufacturing a CMOS device having dual metal gateUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 21, 2010·22 cites·55 claims
- 0687US7608522B2Method for fabricating a hybrid orientation substrateUNITED MICROELECTRONICS CORP·Filed 2007·Granted Oct 27, 2009·11 cites·10 claims
- 0785US11943877B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Mar 26, 2024·1 cites·6 claims
- 0883US9875949B2Electronic package having circuit structure with plurality of metal layers, and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jan 23, 2018·5 cites·24 claims
- 0973US9601403B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·19 claims
- 1073US7804141B2Semiconductor element structure and method for making the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 28, 2010·4 cites·8 claims
- 1169US8816439B2Gate structure of semiconductor deviceYU CHIH-HAO·Filed 2010·Granted Aug 26, 2014·2 cites·16 claims
- 1269US7838946B2Method for fabricating semiconductor structure and structure of static random access memoryUNITED MICROELECTRONICS CORP·Filed 2008·Granted Nov 23, 2010·2 cites·7 claims
- 1369US2025240887A1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1463US2025240889A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1561US2025239511A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1660US7659189B2Method for forming fully silicided gate electrode in a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2007·Granted Feb 9, 2010·2 cites·12 claims
- 1760US2025239558A1Substrate structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1857US12506056B2Electronic package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 1956US8829672B2Semiconductor package, package structure and fabrication method thereofCHEN YAN-HENG·Filed 2012·Granted Sep 9, 2014·1 cites·14 claims
- 2055US9034102B2Method of fabricating hybrid orientation substrate and structure of the sameHUANG YAO-TSUNG·Filed 2007·Granted May 19, 2015·1 cites·15 claims
- 2155US7682932B2Method for fabricating a hybrid orientation substrateUNITED MICROELECTRONICS CORP·Filed 2008·Granted Mar 23, 2010·0 cites·26 claims
- 2254US12200861B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 14, 2025·0 cites·7 claims
- 2352US9117698B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 2450US7759202B2Method for forming semiconductor device with gates of different materialsUNITED MICROELECTRONICS CORP·Filed 2008·Granted Jul 20, 2010·0 cites·22 claims
- 2549US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2647US7998818B2Method for making semiconductor element structureUNITED MICROELECTRONICS CORP·Filed 2010·Granted Aug 16, 2011·0 cites·12 claims
- 2747US2008272435A1Semiconductor device and method of forming the sameLIN CHIEN-TING·Filed 2007·Application pending·0 cites
- 2846US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2944US9076796B2Interconnection structure for package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 7, 2015·0 cites·35 claims
- 3044US8685811B2Method for manufacturing a CMOS device having dual metal gateLIN CHIEN-TING·Filed 2008·Granted Apr 1, 2014·0 cites·12 claims
- 3142US2012181562A1Package having a light-emitting element and method of fabricating the sameLEE WEN-HAO·Filed 2012·Application pending·0 cites
- 3241US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3340US8970038B2Semiconductor substrate and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Mar 3, 2015·0 cites·20 claims
- 3437US10242972B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 26, 2019·0 cites·27 claims
- 3533US2016307833A1Electronic packaging structure and method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3630US2017181287A1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →