Inventor · disambiguated record
Gudrun Stranzl
Also filed as: STRANZL GUDRUN
26 granted patents·2 pending applications·87 citations·filing 2012–2019
94Inventor score
Top patents by PatentIndex Score
28 records- 0197US9496193B1Semiconductor chip with structured sidewallsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 15, 2016·38 cites·23 claims
- 0294US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0389US10032670B2Plasma dicing of silicon carbideINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 24, 2018·6 cites·27 claims
- 0482US9704748B2Method of dicing a waferINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·4 cites·35 claims
- 0579US9219011B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·3 cites·12 claims
- 0675US9966277B2Arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 8, 2018·2 cites·10 claims
- 0775US9257342B2Methods of singulating substrates to form semiconductor devices using dummy materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 9, 2016·2 cites·22 claims
- 0874US9610543B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·2 cites·17 claims
- 0972US8748297B2Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill materialSTRANZL GUDRUN·Filed 2012·Granted Jun 10, 2014·3 cites·28 claims
- 1068US8748307B2Use of a protection layer to protect a passivation while etching a waferHIRSCHLER JOACHIM·Filed 2012·Granted Jun 10, 2014·2 cites·19 claims
- 1167US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 1266US9293371B2Method for processing a semiconductor workpiece with metallizationINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 22, 2016·1 cites·8 claims
- 1364US9093385B2Method for processing a semiconductor workpiece with metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 28, 2015·1 cites·26 claims
- 1458US10672716B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 2, 2020·0 cites·17 claims
- 1557US10005659B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 1655US11077525B2Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamberINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·0 cites·31 claims
- 1755US9741618B2Methods of forming semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 22, 2017·0 cites·23 claims
- 1854US11063014B2Semiconductor devices including a metal silicide layer and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 1954US9449928B2Layer arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·11 claims
- 2053US11282805B2Silicon carbide devices and methods for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 2153US9490103B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 8, 2016·0 cites·9 claims
- 2251US10020264B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 10, 2018·0 cites·17 claims
- 2350US9455192B2Kerf preparation for backside metallizationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 2449US2015147850A1Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2548US9449876B2Singulation of semiconductor dies with contact metallization by electrical discharge machiningINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·18 claims
- 2645US9059273B2Methods for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 16, 2015·0 cites·25 claims
- 2744US8772133B2Utilization of a metallization scheme as an etching maskENGELHARDT MANFRED·Filed 2012·Granted Jul 8, 2014·0 cites·14 claims
- 2843US2015221523A1Arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →