Inventor · disambiguated record
Henrik Ewe
Also filed as: EWE HENRIK
20 granted patents·4 pending applications·140 citations·filing 2006–2015
94Inventor score
Files withINFINEON TECHNOLOGIES AG11EWE HENRIK8EDER ANDREAS1INFINEON TECHNOLOGIES AUSTRIA1INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
24 records- 0193US8120158B2Laminate electronic deviceEWE HENRIK·Filed 2009·Granted Feb 21, 2012·28 cites·15 claims
- 0293US7479691B2Power semiconductor module having surface-mountable flat external contacts and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 20, 2009·31 cites·23 claims
- 0390US8507320B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 13, 2013·17 cites·10 claims
- 0486US7821128B2Power semiconductor device having lines within a housingINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 26, 2010·15 cites·22 claims
- 0583US7524775B2Method for producing a dielectric layer for an electronic componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 28, 2009·9 cites·23 claims
- 0680US8952545B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·4 cites·10 claims
- 0778US8664043B2Method of manufacturing a laminate electronic device including separating a carrier into a plurality of partsEWE HENRIK·Filed 2009·Granted Mar 4, 2014·6 cites·25 claims
- 0874US8201326B2Method of manufacturing a semiconductor deviceEWE HENRIK·Filed 2008·Granted Jun 19, 2012·5 cites·20 claims
- 0971US8097936B2Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor componentEWE HENRIK·Filed 2007·Granted Jan 17, 2012·5 cites·23 claims
- 1071US7955901B2Method for producing a power semiconductor module comprising surface-mountable flat external contactsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 7, 2011·6 cites·25 claims
- 1170US9142739B2Method and system for providing a reliable light emitting diode semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·2 cites·21 claims
- 1270US8866302B2Device including two semiconductor chips and manufacturing thereofEWE HENRIK·Filed 2011·Granted Oct 21, 2014·3 cites·22 claims
- 1369US9123687B2Method of manufacturing a semiconductor deviceEWE HENRIK·Filed 2012·Granted Sep 1, 2015·2 cites·20 claims
- 1469US9059155B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 1568US10020245B2Laminate electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 10, 2018·1 cites·20 claims
- 1664US9437548B2Chip package and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 1763US7662726B2Integrated circuit device having a gas-phase deposited insulation layerINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 16, 2010·2 cites·12 claims
- 1859US7838978B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 23, 2010·1 cites·5 claims
- 1950US9059083B2Semiconductor deviceEWE HENRIK·Filed 2007·Granted Jun 16, 2015·0 cites·10 claims
- 2045US2010067200A1Data carrier for contactless data transmission and a method for producing such a data carrierEWE HENRIK·Filed 2009·Application pending·0 cites
- 2145US2015279782A1Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 2243US7799601B2Electronic device and method of manufacturing sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 21, 2010·0 cites·18 claims
- 2341US2012061700A1Method and system for providing a reliable light emitting diode semiconductor deviceEDER ANDREAS·Filed 2010·Application pending·0 cites
- 2435US2013341780A1Chip arrangements and a method for forming a chip arrangementSCHARF THORSTEN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →